公开(公告)号：US10334755B2

公开(公告)日：2019-06-25

申请号：US15388914

申请日：2016-12-22

Applicant: IMEC VZW

Inventor： Herman Oprins ,  Vladimir Cherman ,  Eric Beyne

IPC: H05K7/20 ,  H05K5/06 ,  H01L23/473

Abstract: A liquid cooling system for cooling an electronic device comprising a chip or a chip package comprising a chip is described. The liquid cooling system comprises an inlet plenum comprising a coolant feeding channel oriented substantially parallel with the plane of a main surface to be cooled of the chip and a plurality of inlet cooling channels fluidically connected to the coolant feeding channel and arranged vertically for impinging a liquid coolant directly on said main surface of the chip. The vertically oriented inlet cooling channels are substantially parallel to vertically oriented outlet cooling channels and are separated by a thermally isolating material. The liquid cooling system further comprises at least one cavity wherein a plurality of inlet and outlet cooling channels end. The cavity is arranged for allowing interaction between the liquid coolant and the main surface of the chip and thus comprises a heat transfer region.

公开(公告)号：US20170196120A1

公开(公告)日：2017-07-06

申请号：US15388914

申请日：2016-12-22

Applicant: IMEC VZW

Inventor： Herman Oprins ,  Vladimir Cherman ,  Eric Beyne

IPC: H05K7/20 ,  H05K5/06

CPC classification number: H05K7/20272 ,  H01L23/4735 ,  H01L24/00 ,  H05K5/06

Abstract: A liquid cooling system for cooling an electronic device comprising a chip or a chip package comprising a chip is described. The liquid cooling system comprises an inlet plenum comprising a coolant feeding channel oriented substantially parallel with the plane of a main surface to be cooled of the chip and a plurality of inlet cooling channels fluidically connected to the coolant feeding channel and arranged vertically for impinging a liquid coolant directly on said main surface of the chip. The vertically oriented inlet cooling channels are substantially parallel to vertically oriented outlet cooling channels and are separated by a thermally isolating material. The liquid cooling system further comprises at least one cavity wherein a plurality of inlet and outlet cooling channels end. The cavity is arranged for allowing interaction between the liquid coolant and the main surface of the chip and thus comprises a heat transfer region.

公开(公告)号：US20240213120A1

公开(公告)日：2024-06-27

申请号：US18393221

申请日：2023-12-21

Applicant: IMEC vzw

Inventor： Herman Oprins ,  Geert Van der Plas ,  Eric Beyne ,  Pieter Woeltgens

IPC: H01L23/48 ,  H01L23/46 ,  H01L23/528 ,  H01L25/065

CPC classification number: H01L23/481 ,  H01L23/46 ,  H01L23/5283 ,  H01L25/0657

Abstract: A micro-electronic component, for example an integrated circuit chip, is provided. In one aspect, the component includes a front-end-of-line (FEOL) portion and a back-end-of-line (BEOL) portion at its front side. A back side power delivery network (PDN) is present at the back side of the component, with via connections connecting the PDN to the FEOL and BEOL portions. The back side PDN includes a “dry part” and a “wet part,” where the dry part includes multiple interconnect levels of the PDN embedded in a dielectric material. The “wet part” includes the remaining PDN levels which are not embedded in a dielectric but which are part of a manifold structure configured to receive therein a flow of cooling fluid in order to remove heat generated by the devices in the FEOL portion.

公开(公告)号：US20240121914A1

公开(公告)日：2024-04-11

申请号：US18480029

申请日：2023-10-03

Applicant: IMEC VZW

Inventor： Vladimir Cherman ,  Herman Oprins ,  Eric Beyne

IPC: H05K7/20

CPC classification number: H05K7/20327 ,  H05K7/20318

Abstract: A cooling device configured to be mounted in close proximity to an electronic component that is to be cooled is provided. In one aspect, the device includes impingement channels and return channels for guiding a flow of cooling fluid towards and away from a cooled surface of the electronic component. The device also includes a heat exchanger and a pump, so that the flow cycle of a cooling fluid is fully confined within the device itself. The impingement channels, the return channels, and the heat exchanger are integrated in a common housing, which includes an inlet opening and an outlet opening for coupling the device to a refrigerant loop. The pump may be a micropump mounted directly on the housing and coupled to the inlet and outlet openings in the housing. A cooling system including the device and the refrigerant loop is also provided.