公开(公告)号：JP2003170286A

公开(公告)日：2003-06-17

申请号：JP2002307077

申请日：2002-10-22

Applicant: IMRA AMERICA INC

Inventor： PATEL RAJESH S ,  BOVATSEK JAMES M

IPC: B23K26/00 ,  B23K26/08 ,  B23K26/38 ,  F02M61/18

Abstract: PROBLEM TO BE SOLVED: To provide a laser drilling and processing method for forming a hole of a profile having an exit opening larger than an entrance opening. SOLUTION: To form a through-hole 28 which is counter-tapered, a laser beam 26 of sufficient energy for ablating the material is directed onto an impingement location on a first surface 22 of the material along an incidence axis, the incidence axis being offset from a normal to the first surface at the impingement location. The material and the laser beam 26 are relatively rotated by at least 360° so that the through-hole having the exit opening larger than the entrance opening can be formed. COPYRIGHT: (C)2003,JPO

公开(公告)号：DE10249188A1

公开(公告)日：2003-05-15

申请号：DE10249188

申请日：2002-10-22

Applicant: IMRA AMERICA INC

Inventor： PATEL RAJESH S ,  BOVATSEK JAMES M

IPC: B23K26/00 ,  B23K26/08 ,  B23K26/38 ,  F02M61/18

Abstract: The method involves directing a laser beam with adequate energy to ablate the material along an axis of incidence and at a point of incidence on a first surface of the material, whereby the incidence axis is offset from the normal at the point of incidence, and moving the material and laser beam relative to each other on a closed path.

公开(公告)号：WO2005101592A3

公开(公告)日：2005-11-17

申请号：PCT/US2005008622

申请日：2005-03-14

Applicant: IMRA AMERICA INC ,  SHAH LAWRENCE ,  BOVATSEK JAMES M ,  ARAI ALAN Y ,  YAMAMOTO TADASHI ,  PATEL RAJESH S ,  HARTER DONALD J

Inventor： SHAH LAWRENCE ,  BOVATSEK JAMES M ,  ARAI ALAN Y ,  YAMAMOTO TADASHI ,  PATEL RAJESH S ,  HARTER DONALD J

IPC: G01J11/00 ,  H01S3/00 ,  H01S3/067 ,  H01S3/10 ,  H01S3/102 ,  H01S3/109 ,  H01S3/13 ,  H01S3/16 ,  H01S3/23

CPC classification number: H01S3/10038 ,  G01J11/00 ,  H01S3/0014 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0064 ,  H01S3/0078 ,  H01S3/06754 ,  H01S3/10023 ,  H01S3/10061 ,  H01S3/102 ,  H01S3/1024 ,  H01S3/108 ,  H01S3/109 ,  H01S3/1305 ,  H01S3/1618

Abstract: A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.

Abstract translation: 飞秒激光激光处理系统，具有飞秒激光，变频光学，光束操纵光学，目标运动控制，处理室，诊断系统和系统控制模块。 基于飞秒激光的激光处理系统允许利用微加工中的独特热控制，并且该系统具有更大的输出光束稳定性，连续可变的重复率和独特的时间光束整形能力。