Patent search ap:("INFINEON TECHNOLOGIES AG") AND inv:"BAIER ULRICH" Page 1

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发明专利
Inserting structures into a substrate used in VLSI technology comprises applying a photo-sensitive layer on an uppermost layer, forming structures on the photo-sensitive layer 未知

公开(公告)号：DE10301291B3

公开(公告)日：2004-08-26

申请号：DE10301291

申请日：2003-01-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAIER ULRICH , GENZ OLIVER

IPC: H01L21/311 , H01L21/768 , H01L21/28

Abstract: Inserting structures into a substrate (4) comprises applying a photosensitive layer (1) on an uppermost layer, forming structures on the photosensitive layer by lithography, etching the photosensitive layer, transferring the structure produced by the photosensitive layer into a layer (2) of a layer stack, and etching a layer (3) in the layer stack.

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