Abstract:
The invention relates to a random number generator comprising a number of semi-conductor elements comprising, on average, one electrically active disrupt cell in the frequency band which is important for processing, in the crystalline structure thereof. A suitable transistor is selected by a charge/detector unit and the charge thereof or an alteration of the charge in the electrically active disrupt cell of the selected transistor is determined. A random number is formed from the detected charge or alteration of the charge by means of a random number conversion unit.
Abstract:
Disclosed is an integrated circuit arrangement (140), among others, comprising a preferably planar transistor (142) and a capacitor (144). The lower electrode of the capacitor (144) is disposed within an SOl substrate along with a channel section of the transistor (142). The inventive circuit arrangement (140) is easy to produce and has excellent electronic properties.
Abstract:
The invention relates to a measuring cell for receiving an electric potential of a sample. Said cell has a common substrate for a sensor, which converts a sample into an electric potential and for an amplifier circuit, which is connected to the sensor. The measuring field contains several measuring cells. The measuring cell can also be used to subject a sample to an electric potential, by applying an electric signal to the amplifier circuit.
Abstract:
The invention relates to a force sensor based on an organic field effect transistor (10) that is applied to a substrate (1; 11). According to the invention, a mechanical force that acts on the transistor causes a corresponding modification of the source-drain voltage or the source-drain current (ID), whereby said modification can be respectively detected as a measured variable (Vmess, Imess) for the exerted force. The invention also relates to a membrane-based pressure sensor that uses a force sensor of this type, to a one- or two-dimensional position sensor that uses a plurality of force sensors of this type and to a fingerprint sensor that uses a plurality of force sensors of this type.
Abstract:
The surface optimisation of components in integrated circuits with m components may be determined by a method comprising the following steps: fixing a pre-set repeat precision sigmaout; determination of the minimum surface area Ai for components of the circuit with a data processing unit; whereby the minimum surface area Ai of an i-th component in the circuit is determined by the following equation (I): where cij is a matching constant for the j-th of n electrical parameters with 1
Abstract:
According to the invention, an electrical characteristic of a material layer (3) or layer-type material structure is measured at various points provided with connection contacts (5, 6). A mean value of the measurement, taken from a base set of IC chips, is subtracted from a respective value, and a digital word for identifying the chip in question is formed on the basis of the result thus obtained, for each IC chip. The measurement can be carried out by means of a cross-correlation, the measuring regions crossing over each other.
Abstract:
The surface optimisation of components in integrated circuits with m components may be determined by a method comprising the following steps: fixing a pre-set repeat precision σout; determination of the minimum surface area Ai for components of the circuit with a data processing unit; whereby the minimum surface area Ai of an i-th component in the circuit is determined by the following equation (I): where cij is a matching constant for the j-th of n electrical parameters with 1
Abstract:
An integrated circuit arrangement (300) has at least one electronic component (302), and also at least one resistance determining circuit that is coupled to the electronic component and is monolithically integrated with the latter and serves for determining the parasitic non-reactive resistance (303) of at least the lead to the at least one electronic component.
Abstract:
A clock transistor and a second operating potential functioning as a circuit breaker, are mounted between the outlet of an NMOS logic circuit.
Abstract:
Disclosed is an integrated circuit arrangement (120), among others, comprising a transistor (122), preferably a FinFET, and a capacitor (124). The lower electrode of the capacitor (124) is disposed within an SOl substrate along with a channel section of the transistor (122). The inventive circuit arrangement (120) is easy to produce and has excellent electronic properties.