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公开(公告)号:DE10006968A1
公开(公告)日:2001-09-06
申请号:DE10006968
申请日:2000-02-16
Applicant: INFINEON TECHNOLOGIES AG
Inventor: BEER GOTTFRIED , BRENNER WALTER
Abstract: Process for removing adhesion promoters used in the production of semiconductors comprises directing a laser beam onto regions of a surface covered with an adhesion promoter. An Independent claim is also included for a device for applying chips onto a leadframe or for applying bonding wires between a semiconductor chip and a leadframe. Preferred Features: The surface processed with the laser beam is held in a protective gas atmosphere. The laser beam is used in impulses.