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公开(公告)号:DE10343524B4
公开(公告)日:2005-07-21
申请号:DE10343524
申请日:2003-09-19
Applicant: INFINEON TECHNOLOGIES AG
Inventor: DICKMANN RORY
IPC: G06F11/24 , G06F13/16 , G11C7/10 , G11C11/4093 , G11C11/407
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公开(公告)号:DE10343524A1
公开(公告)日:2005-05-04
申请号:DE10343524
申请日:2003-09-19
Applicant: INFINEON TECHNOLOGIES AG
Inventor: DICKMANN RORY
IPC: G06F11/24 , G06F13/16 , G11C7/10 , G11C11/4093 , G11C11/407
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公开(公告)号:DE102004029200A1
公开(公告)日:2006-01-12
申请号:DE102004029200
申请日:2004-06-16
Applicant: INFINEON TECHNOLOGIES AG
Inventor: DICKMANN RORY , SOMMER MICHAEL
Abstract: The invention relates a substrate for a package for an electronic circuit and methods for packaging an electronic circuit with a substrate. The substrate comprises at least one conduction region and an activation region arranged within the substrate. The activation region is generally in contact with the conduction region and is configured to change its electrical resistance when activation occurs.
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公开(公告)号:DE102004016978A1
公开(公告)日:2005-06-30
申请号:DE102004016978
申请日:2004-04-07
Applicant: INFINEON TECHNOLOGIES AG
Inventor: DICKMANN RORY
IPC: H03K17/16 , H03K19/0185 , H03K19/003
Abstract: The circuit has an amplifier circuit (21) for adjusting a phase voltage level of an output signal from an output driver (1) based on a phase of the output signal, which initializes a control voltage level of a control signal. A resistance circuit (24) adjusts the control voltage level based on its resistance value. The resistance circuit has a resistance unit that is activatable or deactivatable at the resistance value. An independent claim is also included for a driving circuit with control circuits.
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公开(公告)号:DE10329206B3
公开(公告)日:2004-11-04
申请号:DE10329206
申请日:2003-06-28
Applicant: INFINEON TECHNOLOGIES AG
Inventor: DICKMANN RORY , PFEIFFER MICHAEL
IPC: H01L23/528
Abstract: The integrated circuit has a number of supply terminals (7A,7B,7C; 9A,9B,9C) for delivering a supply voltage to the integrated circuit and a number of output drivers supplied by the supply voltage, divided into 2 output driver groups, each supplied via a respective supply line segment (3A,3B,3C; 5A,5B,5C) connected to a respective supply terminal. The supply line segments are connected by a resistance (10) lying in a metallization plane below the metallization plane of the supply line segments.
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公开(公告)号:DE102004029200B4
公开(公告)日:2006-10-19
申请号:DE102004029200
申请日:2004-06-16
Applicant: INFINEON TECHNOLOGIES AG
Inventor: DICKMANN RORY , SOMMER MICHAEL
Abstract: The invention relates a substrate for a package for an electronic circuit and methods for packaging an electronic circuit with a substrate. The substrate comprises at least one conduction region and an activation region arranged within the substrate. The activation region is generally in contact with the conduction region and is configured to change its electrical resistance when activation occurs.
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公开(公告)号:DE10331607A1
公开(公告)日:2005-02-17
申请号:DE10331607
申请日:2003-07-12
Applicant: INFINEON TECHNOLOGIES AG
Inventor: DICKMANN RORY
IPC: H03K19/003
Abstract: One embodiment of the invention provides an output driver for an integrated circuit. The output driver has a driver circuit for driving an input signal onto an output line. The driver circuit is dimensioned in such a way as to supply a current intensity dependent on the input signal to be driven and/or a potential dependent on the input signal to be driven on the output line. The current value and/or the potential value lie in a current intensity range and/or potential range defined by a predetermined specification. The driver strength of the driver circuit may be set in accordance with a control signal. A measuring circuit is provided to measure the current intensity of the current flowing on the output line and/or the potential of the output line. A control circuit serves for setting the driver strength of the driver circuit so that the potential on the output line is set to a potential value and/or the current intensity is set to a current value, wherein the set potential value and the set current value may lie in a lower power range of the current intensity range and/or potential range prescribed by the specification.
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公开(公告)号:DE10331607B4
公开(公告)日:2007-02-15
申请号:DE10331607
申请日:2003-07-12
Applicant: INFINEON TECHNOLOGIES AG
Inventor: DICKMANN RORY
IPC: H03K19/003
Abstract: One embodiment of the invention provides an output driver for an integrated circuit. The output driver has a driver circuit for driving an input signal onto an output line. The driver circuit is dimensioned in such a way as to supply a current intensity dependent on the input signal to be driven and/or a potential dependent on the input signal to be driven on the output line. The current value and/or the potential value lie in a current intensity range and/or potential range defined by a predetermined specification. The driver strength of the driver circuit may be set in accordance with a control signal. A measuring circuit is provided to measure the current intensity of the current flowing on the output line and/or the potential of the output line. A control circuit serves for setting the driver strength of the driver circuit so that the potential on the output line is set to a potential value and/or the current intensity is set to a current value, wherein the set potential value and the set current value may lie in a lower power range of the current intensity range and/or potential range prescribed by the specification.
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公开(公告)号:DE102004030354B3
公开(公告)日:2006-03-09
申请号:DE102004030354
申请日:2004-06-23
Applicant: INFINEON TECHNOLOGIES AG
Inventor: DICKMANN RORY
IPC: H01L21/768 , H01L23/525
Abstract: The method involves providing a semiconductor substrate (10) and generating two connector regions (14,16). A provisional structure (12) for the conductor structure is formed embedded in the substrate and between the two connector regions. The provisional structure does not form any electrically conductive connections or only a connection with very low electrical conductivity. Energy is then locally provided to the provisional structure to convert the structure into a conductor structure. The conductor structure forms a connection between the connector regions which is more conductive than any connection formed by the provisional structure. The provisional structure is generated by forming a p-doped region and an n-doped region which overlaps the p-doped region. The p-doping and the n-doping in the region of overlap compensate each other for the local application of energy so that no free charge carriers are present. The provisional structure is converted into the conductive structure in that the concentrations of dopants in the overlapping region are greatly varied, to different extents, by diffusion. Independent claims also cover an integrated circuit made according to the method.
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公开(公告)号:DE10343525A1
公开(公告)日:2004-04-15
申请号:DE10343525
申请日:2003-09-19
Applicant: INFINEON TECHNOLOGIES AG
Inventor: DICKMANN RORY
IPC: G06F9/45 , G06F13/16 , G06F15/177 , G06F17/50 , G11C7/04 , G11C11/407
Abstract: A method for operating semiconductor building blocks, especially memory blocks arranged and grouped as modules connected to a common data bus, in which each building block (IC1-IC36) on each module (M1-M4) is connected with at least one data line (DQ1-DQ72) of the data bus. Initially a group of semiconductor blocks is selected from semiconductor blocks (IC1-IC36) arranged on the modules (M1-M4) independently of the modules according to a given selection criterion. The semiconductor blocks (IC1-IC36) of the selected group are activated and a data exchange is carried out between the data lines (DQ1-DQ72) of the data bus (DQ) and the selected groups of semiconductor blocks (IC1-IC36). Independent claims are given for (A) a control device for semiconductor building blocks, in particular memory blocks, and (B) an arrangement for driving a grouping of memory blocks on a common data bus.
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