公开(公告)号：DE102005062344A1

公开(公告)日：2007-07-05

申请号：DE102005062344

申请日：2005-12-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST ,  DANGELMAIER JOCHEN ,  ENGL MARIO

IPC: H01L23/50 ,  H01L21/60 ,  H01L23/66

Abstract: A semiconductor assembly has at least one chip (3), a substrate, contact terminals (4) mounted on the substrate, and first and second sets of one or more contact surfaces (pads) for conducting HF and LF signals respectively. The chip is arranged on the substrate between the pads (5) so that the chip (3) relative to a central position, is offset relative to all the pads (5) and that the bonding wires are shorter for the first set of pads than those of the second set. An independent claim is included for a method for fabricating a semiconductor assembly.

公开(公告)号：DE102005062344B4

公开(公告)日：2010-08-19

申请号：DE102005062344

申请日：2005-12-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST ,  DANGELMAIER JOCHEN ,  ENGL MARIO

IPC: H01L23/50 ,  H01L21/60 ,  H01L23/66