Abstract:
Disclosed is a structuring method, among other things. According to said method, a filling material (22) having a T-shaped cross section is used as a structuring mask in order to create structures with sublithographic dimensions, particularly a double-fin field effect transistor.
Abstract:
The invention relates to a method for producing: a sublithographic gate structure; an associated field effect transistor; an associated inverter, and; an associated inverter structure. A sublithographic gate structure (SG) having slight variations in the critical dimensions thereof can be directly produced on the lateral walls of a lithographically structured mask (M0, 2) by the conformal formation of a gate insulation layer (3) and of a gate layer with subsequently executed anisotropic etching.
Abstract:
An interconnect connection structure having first and second interconnects and multiple connection elements that electrically connect the first interconnect to the second interconnect is described. The multiple connection elements are formed laterally in a lateral region of the first and second interconnects relative to an overlay orientation of the interconnects. A central region may be free of connection elements so that electro-migration properties of the connection structure are improved and the current-carrying capacity is increased.
Abstract:
A method for fabricating a short channel field-effect transistor is presented. A sublithographic gate sacrificial layer is formed, as are spacers at the side walls of the gate sacrificial layer. The gate sacrificial layer is removed to form a gate recess and a gate dielectric and a control layer are formed in the gate recess. The result is a short channel field-effect transistor with minimal fluctuations in the critical dimensions in a range below 100 nanometers.