公开(公告)号：DE19962677A1

公开(公告)日：2001-07-05

申请号：DE19962677

申请日：1999-12-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FEURLE ROBERT ROBERT ,  SAVIGNAC DOMINIQUE

IPC: G01R31/28 ,  G01R31/3185 ,  G11C11/401 ,  G11C29/56 ,  H01L21/66

Abstract: The configuration allows for testing a multiplicity of semiconductor chips with respect to critical parameters on the wafer level. Each of the semiconductor chips on a semiconductor wafer is additionally provided with at least one option pad. The option pad allows access for a test program to the chip for separating out the semiconductor chips which do not correspond to predetermined requirements for critical parameters.

公开(公告)号：DE19946495C2

公开(公告)日：2002-10-24

申请号：DE19946495

申请日：1999-09-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FEURLE ROBERT ROBERT

IPC: H01L27/04 ,  G01R31/3185 ,  G11C5/06 ,  G11C5/14 ,  H01L21/822 ,  H01L21/66 ,  H01L23/50 ,  H01L23/58 ,  H01L23/528 ,  G01R31/316

Abstract: The measuring pad reduction arrangement uses an A/D converter (3) within the IC chip (1) for providing digital internal voltage values supplied via an input/output pad (9) to an external fuse cutter (5), for cutting fuses (7) within the IC chip. The internal voltages are supplied to the A/D converter from different points within the integrated circuit, the external fuse cutter having a processor (6) comparing the internal voltage values with required values for selective cutting of the fuses.

公开(公告)号：DE19946495A1

公开(公告)日：2001-04-19

申请号：DE19946495

申请日：1999-09-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FEURLE ROBERT ROBERT

IPC: H01L27/04 ,  G01R31/3185 ,  G11C5/06 ,  G11C5/14 ,  H01L21/822 ,  H01L21/66 ,  H01L23/50 ,  H01L23/58 ,  H01L23/528 ,  G01R31/316

Abstract: The measuring pad reduction arrangement uses an A/D converter (3) within the IC chip (1) for providing digital internal voltage values supplied via an input/output pad (9) to an external fuse cutter (5), for cutting fuses (7) within the IC chip. The internal voltages are supplied to the A/D converter from different points within the integrated circuit, the external fuse cutter having a processor (6) comparing the internal voltage values with required values for selective cutting of the fuses.