Patent search ap:("INFINEON TECHNOLOGIES AG") AND inv:"GROSS HARALD" Page 1

1.

发明专利
未知

公开(公告)号：DE102005062967A1

公开(公告)日：2006-07-13

申请号：DE102005062967

申请日：2005-12-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GROSS HARALD

IPC: H01L23/66

2.

发明专利
Producing wiring structure on wafer substrate for center row arrangement or wafer level packaging comprises sputtering of seed layer to form trench and application of copper layer 未知

公开(公告)号：DE102005055402A1

公开(公告)日：2007-05-31

申请号：DE102005055402

申请日：2005-11-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WALLIS DAVID , GROSS HARALD

IPC: H01L21/60 , H01L21/48 , H01L23/50

Abstract: Forming a wiring structure on a wafer substrate connecting chip bond pads and contact pads for center-row arrangements, wafer-level packages (WLP) or known good dies (KGD) comprises sputtering a seed layer on the structure substrate surface, spinning a photoresist and applying a photolithographic structure to form a square-edged trench, galvanically applying a thin copper layer (12) on trench walls and base, removing the resist and etching the seed layer. A dielectric cover (13) is then spun on.

3.

发明专利
Electronic component with a number of integrated members, is formed by producing members with a surface that contains a circuit, and connecting components using bond wires 未知

公开(公告)号：DE102004039906A1

公开(公告)日：2005-08-18

申请号：DE102004039906

申请日：2004-08-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GROSS HARALD

IPC: H01L21/50 , H01L21/60 , H01L21/98 , H01L23/485 , H01L25/065

Abstract: Producing an electronic component with a number of integrated members, comprises forming planar integrated members (2) with a surface that contains the circuit, and an edge surface with a contact surface (6). At least two components are located on top of each other, and the contact surfaces are connected using bond wires.

Patent Agency Ranking