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公开(公告)号：AT391342T
公开(公告)日：2008-04-15
申请号：AT96102018
申请日：1996-02-12
Applicant: INFINEON TECHNOLOGIES AG
Inventor： PAPE HEINZ , HUBRICH FRANK
IPC: H01L23/495
Abstract: The chip carrier island (3) is fixed to small diagonal supports (12) and has a large central opening (13) extending beyond the edge of the chip on two sides. In the depicted embodiment the opening is circular with dia. about equal to the length of a side of the chip, which is not in contact with the bar region (15) of the island. The area around the opening allows thermal expansion, assists removal of heat and reduces thermo-mechanical deformation.
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