公开(公告)号：DE102005009163A1

公开(公告)日：2006-09-07

申请号：DE102005009163

申请日：2005-02-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAPE HEINZ

IPC: H01L23/50 ,  H01L21/60 ,  H01L23/58

Abstract: A semiconductor device includes a semiconductor chip, where the semiconductor chip includes signal contact areas and supply contact areas. The signal contact areas are arranged on edge regions of the active top side of the semiconductor chip and are electrically connected to external signal exterior connections of the semiconductor device by connecting elements. The active top side of the semiconductor chip includes at least two supply collective electrodes made of annularly patterned metal foils which are arranged within the signal contact areas and are affixed in an electrically insulating manner on the top side. The supply collective electrodes are electrically connected to the supply contact areas of the semiconductor chip by internal connecting elements.

公开(公告)号：DE4030771B4

公开(公告)日：2005-09-08

申请号：DE4030771

申请日：1990-09-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAPE HEINZ

IPC: H01L23/495 ,  H01L23/50 ,  H01L23/14 ,  H01L23/16 ,  H01L23/28

公开(公告)号：DE10144468A1

公开(公告)日：2003-04-03

申请号：DE10144468

申请日：2001-09-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAPE HEINZ ,  WAGIMAN MOHAMAD YAZID B

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L21/60

Abstract: The component (1) contains at least one semiconductor chip (5), located on a chip island (6) of a system support (7). The chip island, w.r.t. outer contacts (4), is embedded in plastics housing substance (8).The semiconductor chip, with bond link (9) between contact faces (10) on its active top side (11) and bond faces (12) on outer contacts is embedded in plastics press substance (13) between the housing (3) underside (2) and the sunk chip island. Independent claims are included for system support and method for manufacturing the system support.

公开(公告)号：DE102005009164B4

公开(公告)日：2007-09-06

申请号：DE102005009164

申请日：2005-02-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAPE HEINZ ,  MARTIN ANDREAS

IPC: H01L23/50 ,  G01R31/28 ,  H05B3/02 ,  H05B3/26

公开(公告)号：DE10147376A1

公开(公告)日：2003-04-24

申请号：DE10147376

申请日：2001-09-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAPE HEINZ

IPC: H01L23/31 ,  H01L23/50

Abstract: Electronic component comprises a plastic housing (2) and a metallic support (3) arranged in the housing. A semiconductor chip (4) is arranged on the metallic support using Flip-Chip technology. The support has outer contacts (5) in complete material thickness (D) and outer contacts (6) of reduced material thickness (d). The outer contacts are connected directly to flip-chip contacts (7) of the active upper side (8) of the semiconductor chip (4). Independent claims are also included for (1) a system support for several electronic components; and (2) a process for the production of the system support.

公开(公告)号：DE19728692C2

公开(公告)日：2002-04-11

申请号：DE19728692

申请日：1997-07-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAPE HEINZ

IPC: H01L23/50 ,  H01L25/16 ,  H01L23/66 ,  H01L23/538 ,  H01L25/04 ,  H01G4/40

Abstract: An IC module has one or more integrated circuits and a package surrounding them. The IC module is distinguished by one or more additional electronic components being accommodated inside the package, in the immediate vicinity of the integrated circuit.

公开(公告)号：DE102005009164A1

公开(公告)日：2006-09-14

申请号：DE102005009164

申请日：2005-02-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAPE HEINZ ,  MARTIN ANDREAS

IPC: H01L23/50 ,  G01R31/28 ,  H05B3/02 ,  H05B3/26

Abstract: The connector surface has a heater structure (1) for testing electrical connection between the surface and an electrical connecting unit. The heater structure is electrically isolated from the surface and includes metallic conducting paths (10). The conducting paths surround the surface at its edges and are arranged meander shaped under the surface. The heater structure is formed from insulation and metal layers sequence. An independent claim is also included for a method of manufacturing and operating a contact connector surface.

公开(公告)号：DE10132385B4

公开(公告)日：2006-07-13

申请号：DE10132385

申请日：2001-07-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAPE HEINZ

IPC: H01L23/50 ,  H01L21/48 ,  H01L23/12 ,  H01L23/31

Abstract: Electronic component has outer edge contacts (300) distributed on the lower side (2), and a semiconductor chip (4) embedded in a plastic pressed composition (5) and arranged on a chip island (6) forming an outer contact. Holding bars (10) are arranged between the outer contacts. The electronic component has recesses (9) on its lower side arranged in the holding bars for the outer contacts. The outer contacts are separated from each other by the recesses. Independent claims are also included for: a system support for several electronic components; a process for the production of the system support; and process for the production of the electronic component. Preferred Features: The recesses are arranged linearly on the lower side of the component and parallel to the lower side edges (14,15, 16,17). The chip island and outer edge contacts have the same material thickness.

公开(公告)号：DE4041346B4

公开(公告)日：2005-10-06

申请号：DE4041346

申请日：1990-12-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAPE HEINZ

IPC: H01L23/495 ,  H01L23/50 ,  H01L23/12

Abstract: The standard plastic housing contg. encapsulated semiconductor chips with integrated circuits on the active surfaces accommodates each chip on a metal base forming an island. The chips are enclosed in a frame formed by the conductor strips which act as the housing terminals. This is joined by thin ribs to the island until chip, island and inner strip portions are enclosed in plastic. Each island is of smaller surface than its chip, which protrudes for 300 microns at least beyond it on each side. At its ends below the chip, the island can be enclosed elastic beads, typically of filled epoxy resin or silicon glue. ADVANTAGE - Compact, without high mechanical stresses in pressed material.

公开(公告)号：AT391342T

公开(公告)日：2008-04-15

申请号：AT96102018

申请日：1996-02-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAPE HEINZ ,  HUBRICH FRANK

IPC: H01L23/495

Abstract: The chip carrier island (3) is fixed to small diagonal supports (12) and has a large central opening (13) extending beyond the edge of the chip on two sides. In the depicted embodiment the opening is circular with dia. about equal to the length of a side of the chip, which is not in contact with the bar region (15) of the island. The area around the opening allows thermal expansion, assists removal of heat and reduces thermo-mechanical deformation.