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    Chip card, method for manufacturing chip card, and conductive connection element
    1.
    发明专利
    Chip card, method for manufacturing chip card, and conductive connection element 有权
    芯片卡，制造卡片的方法和导电连接元件

    公开(公告)号：JP2005322249A

    公开(公告)日：2005-11-17

    申请号：JP2005134687

    申请日：2005-05-02

    Applicant: Infineon Technologies Ag ,  インフィネオン テクノロジーズ アクチエンゲゼルシャフト

    Inventor： KNOLL BERNHARD THEO

    IPC: B42D15/10 ,  B81C1/00 ,  G06K19/073 ,  G06K19/077 ,  G06K19/08 ,  G06K19/10

    CPC classification number: B82Y10/00 ,  G06K19/07743 ,  G06K19/083

    Abstract: PROBLEM TO BE SOLVED: To provide a chip card including a conductive connection element having improved safety against forgery. SOLUTION: The chip card is provided with a carrier element, at least one conductive connection element (300) in a surface area of the carrier element and at least one electric circuit on an upper part/or inside of the carrier element and to be connected with at least one conductive connection element (300). Micro-structure (302) and/or nano structure sized to absorb electromagnetic radiation of at least one wavelength is provided on the inside of at least one conductive connection element (300). COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种芯片卡，其包括具有改进的防伪安全性的导电连接元件。 解决方案：芯片卡设置有载体元件，载体元件的表面区域中的至少一个导电连接元件（300）和载体元件的上部/ /内部上的至少一个电路，以及 与至少一个导电连接元件（300）连接。 在至少一个导电连接元件（300）的内部设置尺寸适于吸收至少一个波长的电磁辐射的微结构（302）和/或纳米结构。 版权所有（C）2006，JPO＆NCIPI

    4.
    发明专利
    未知

    公开(公告)号：DE102006013588A1

    公开(公告)日：2007-09-27

    申请号：DE102006013588

    申请日：2006-03-22

    Applicant: FACHHOCHSCHULE DEGGENDORF ,  INFINEON TECHNOLOGIES AG

    Inventor： BENSTETTER GUENTHER ,  BREITSCHOPF PETER ,  KNOLL BERNHARD THEO

    IPC: G01Q60/46

    Abstract: A method and an apparatus is disclosed for two-dimensional profiling of doping profiles of a material sample with scanning capacitance microscope. A scanning of a two-dimensional structure of a dielectric or partially dielectric material sample with a tip of a probe of the scanning microscope is carried out. The change in capacitance during the scanning motion of the probe from one position on the material sample to the next is measured. Finally, an evaluation of the change in capacitance during the scanning motion of the probe from one position on the material sample to the next as a current is carried out.

    5.
    发明专利
    未知

    公开(公告)号：FR2870026B1

    公开(公告)日：2006-11-24

    申请号：FR0504553

    申请日：2005-05-04

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： KNOLL BERNHARD THEO

    IPC: B42D15/10 ,  G06K19/077 ,  B81C1/00 ,  G06K19/073 ,  G06K19/08 ,  G06K19/10

    Abstract: Chip card comprises a support element (201), at least one electrical conducting element (202) in contact with a part of the surface of the support element and at least one electric circuit (203) on and/or in the support element and connected to the conducting element. It is arranged in the conducting element in contact with some micro-structures and/or nanostructures with a dimension such that the micro-structures and/or nanostructures absorb electromagnetic radiation of at least one wavelength. Independent claims are also included for : (a) production of this chip card; (b) an electrical conducting element arranged in some micro- structures and/or nanostructures.

    6.
    发明专利
    未知

    公开(公告)号：DE502005007625D1

    公开(公告)日：2009-08-13

    申请号：DE502005007625

    申请日：2005-05-18

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： KNOLL BERNHARD THEO

    IPC: G06K19/077

    Abstract: One aspect of the invention relates to a transceiver device with a substrate with a layer of dielectric material with a relative permeability of greater than 1 and/or with a magnetic material with a relative magnetic permeability of greater than 1. An antenna is monolithically integrated in the substrate and/or in the layer, and the antenna is arranged for transmitting and for receiving signals. A circuit is monolithically integrated in the substrate which is coupled to the monolithically integrated antenna.

    7.
    发明专利
    未知

    公开(公告)号：DE102004029440A1

    公开(公告)日：2006-01-12

    申请号：DE102004029440

    申请日：2004-06-18

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： KNOLL BERNHARD THEO

    IPC: G06K19/077 ,  H01Q1/38 ,  H01Q13/08 ,  H04B1/38 ,  H04B1/59

    Abstract: One aspect of the invention relates to a transceiver device with a substrate with a layer of dielectric material with a relative permeability of greater than 1 and/or with a magnetic material with a relative magnetic permeability of greater than 1. An antenna is monolithically integrated in the substrate and/or in the layer, and the antenna is arranged for transmitting and for receiving signals. A circuit is monolithically integrated in the substrate which is coupled to the monolithically integrated antenna.

    8.
    发明专利
    未知

    公开(公告)号：DE102004021872B3

    公开(公告)日：2005-12-22

    申请号：DE102004021872

    申请日：2004-05-04

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： KNOLL BERNHARD THEO

    IPC: B42D15/10 ,  B81C1/00 ,  G06K19/073 ,  G06K19/077 ,  G06K19/08 ,  G06K19/10

    Abstract: Chip card comprises a support element (201), at least one electrical conducting element (202) in contact with a part of the surface of the support element and at least one electric circuit (203) on and/or in the support element and connected to the conducting element. It is arranged in the conducting element in contact with some micro-structures and/or nanostructures with a dimension such that the micro-structures and/or nanostructures absorb electromagnetic radiation of at least one wavelength. Independent claims are also included for : (a) production of this chip card; (b) an electrical conducting element arranged in some micro- structures and/or nanostructures.

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