公开(公告)号：DE10062108B4

公开(公告)日：2010-04-15

申请号：DE10062108

申请日：2000-12-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： TADROS YEHIA ,  THOBEN MARKUS ,  PALM GERHARD

IPC: H01L23/10 ,  H01L23/051 ,  H01L23/373 ,  H01L25/07 ,  H01L23/46 ,  H01L25/18

Abstract: An electronic power module includes at least one electronic power device, a DCB ceramic substrate, a heat sink and at least one additional thermal capacitance. The electronic power devices are connected by a sintered layer on their underside to an upper copper layer of the DCB ceramic substrate. The upper copper layer of the DCB ceramic substrate is structured into copper conductor tracks for electrically contacting the power devices. The lower copper layer of the DCB ceramic substrate is connected by a sintered layer to a heat sink. The upper sides of the power devices are connected by a sintered layer to an addition thermal capacitance.