公开(公告)号：DE102005014665A1

公开(公告)日：2006-11-02

申请号：DE102005014665

申请日：2005-03-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KROEHNERT STEFFEN ,  PETZOLD GUNNAR ,  OSWALD JENS

IPC: H05K3/34 ,  H01L23/488 ,  H01L23/50 ,  H05K1/11

Abstract: A substrate for producing a soldering connection to a second substrate is disclosed. Soldering pads are distributed on the substrate surface. Solder balls can be applied to these pads. A soldering pad has a top side area and side areas connected to a conductor track. A soldering mask with openings in the region of the soldering pads is applied to the substrate. A soldering pad is provided with holding mechanism for the solder balls in such a way that, within the top side area of the soldering pad, a depression is introduced in the direction of the substrate or an elevation rising above the top side area is applied.