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    2.
    发明专利
    未知

    公开(公告)号：DE10325029A1

    公开(公告)日：2005-01-13

    申请号：DE10325029

    申请日：2003-06-02

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： REISS MARTIN ,  HAIMERL ALFRED ,  KROEHNERT STEFFEN

    IPC: H01L23/31 ,  H01L23/498 ,  H01L23/10 ,  H01L23/16 ,  H01L23/28 ,  H01L23/50

    Abstract: The invention relates to a substrate-based chip package, comprising a substrate on which a chip is fastened by a die-attach material. The substrate is provided with a solder resist (on both sides) and, on the side that is opposite from the chip, has conductor tracks which are provided with solder balls and are connected to the chip by means of wire bridges which extend through a bonding channel which is sealed with a glob top. The chip and the substrate on the chip side being encapsulated by a molded cap.

    3.
    发明专利
    未知

    公开(公告)号：DE102004029587B4

    公开(公告)日：2006-05-24

    申请号：DE102004029587

    申请日：2004-06-18

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： REIS MARTIN ,  LEGEN ANTON ,  KROEHNERT STEFFEN

    IPC: H01L23/04

    Abstract: A ball grid array package includes a substrate. A number of solder balls overlie the solder ball surface of the substrate. The solder balls are arranged within a ballout area. A chip is attached to the chip surface of the substrate by an adhesive layer. Contact pads of the chip are electrically connected to ones of the solder balls. The chip has an area that is smaller than the ballout area and the adhesive layer has an area that is at least as large as the ballout area such that each solder ball in the ballout area is located beneath the adhesive layer.

    4.
    发明专利
    未知

    公开(公告)号：DE10327515A1

    公开(公告)日：2005-01-20

    申请号：DE10327515

    申请日：2003-06-17

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： REIS MARTIN ,  KROEHNERT STEFFEN

    IPC: H01L23/13 ,  H01L23/32

    Abstract: The invention relates to a substrate-based IC package that includes a substrate on which a chip is mounted with a die attach material. The substrate is provided with a solder resist and has, on the side opposite the chip, conductor tracks provided with soldering globules. The conductor tracks are electrically coupled to the chip via wire jumpers, which extend through a bond channel which is filled with a mold compound. The chip and the substrate are encapsulated with a mold cap on the chip side. The substrate is provided with spacers for supporting a printing template for applying the die attach material. A strip of a solder resist that surrounds at least the bond channel gaplessly with essentially the same width is provided as the spacer.

    Producing integrated component for large number of different sizes of microchips, involves ejecting carrier strip with protective layer from cavity or cavities by exerting force on protective layer surface facing cavity using ejector(s)
    5.
    发明专利
    Producing integrated component for large number of different sizes of microchips, involves ejecting carrier strip with protective layer from cavity or cavities by exerting force on protective layer surface facing cavity using ejector(s) 未知

    公开(公告)号：DE102005020427A1

    公开(公告)日：2006-11-09

    申请号：DE102005020427

    申请日：2005-04-29

    Applicant: INFINEON TECHNOLOGIES AG ,  FICO MOLDING SYSTEMS B V

    Inventor： KROEHNERT STEFFEN ,  RAU INGOLF ,  KAHLISCH KNUT ,  HUGEN THEO ,  TEUNISSEN MICHEL

    IPC: H01L21/56 ,  B29C39/36

    Abstract: Producing an integrated component comprises providing a carrier strip with arrangement(s) of chips; placing a casting mold over the carrier strip in such a way that arrangement(s) of chips is covered completely by cavity or cavities of the casting mold; forming a protective layer over arrangement?(s) of chips by filling cavity or cavities with a liquefied encapsulating compound; and ejecting the carrier strip with the protective layer from the cavity or cavities by exerting a force onto a surface of the protective layer facing cavity or cavities. Producing an integrated component comprises providing a carrier strip with arrangement(s) of chips; placing a casting mold over the carrier strip in such a way that arrangement(s) of chips is covered completely by cavity (2) or cavities of the casting mold; forming a protective layer over arrangement?(s) of chips by filling cavity or cavities with a liquefied encapsulating compound; and ejecting the carrier strip with the protective layer from the cavity or cavities by exerting a force onto a surface of the protective layer facing cavity or cavities. The liquefied encapsulating compound transforms into a solid state upon cooling. The force is exerted onto linearly extended surface region(s) of the protective layer. An independent claim is also included for casting mold comprising cavity, and displaceably mounted ejector(s). The cavity is arranged in a contact area. The cavity is delimited by side surfaces (21) and a bottom surface (22). The cavity is designed for the complete coverage of an arrangement of microchips provided on a carrier strip. The ejector(s) is used for ejecting a carrier strip provided with a protective layer. The ejector(s) has linearly extended contact area for the force transmission to the surface of the protective layer.

    7.
    发明专利
    未知

    公开(公告)号：DE10158770A1

    公开(公告)日：2003-06-18

    申请号：DE10158770

    申请日：2001-11-29

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： DOBRITZ STEPHAN ,  KAHLISCH KNUT ,  KROEHNERT STEFFEN

    IPC: H01L23/495 ,  H01L23/50

    Abstract: A leadframe of a conductive material includes a central region to accommodate a chip and a plurality of connecting fingers extending at least from one side in the direction of the central region, a contact region being provided adjacent to the central region on at least some of the connecting fingers. The course of the connecting fingers is such that a sectional face in an arbitrary imaginary cross-section at right angles to the main face of the leadframe has leadframe material. In such a case, it is attempted to keep cross-sections in a component without leadframe material as small as possible.

    8.
    发明专利
    未知

    公开(公告)号：DE10038161A1

    公开(公告)日：2002-02-21

    申请号：DE10038161

    申请日：2000-08-04

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： POHL JENS ,  KROEHNERT STEFFEN

    IPC: H01L23/40 ,  H05K7/20

    Abstract: The invention relates to a cooling device for electronic components. Said cooling device (5) comprises a cooling surface (3) and is larger than the sum of the top surfaces of the electronic components to be cooled. To this end, the cooling device (5) comprises at least one cooling panel (6) coated with a thermoconducting material (7) and a pressing device by means of the which the contours of the top surfaces to be cooled are pressed into the thermoconducting coating (7). The invention further relates to a method for producing a cooling device (5).

    9.
    发明专利
    未知

    公开(公告)号：DE102005014665A1

    公开(公告)日：2006-11-02

    申请号：DE102005014665

    申请日：2005-03-29

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： KROEHNERT STEFFEN ,  PETZOLD GUNNAR ,  OSWALD JENS

    IPC: H05K3/34 ,  H01L23/488 ,  H01L23/50 ,  H05K1/11

    Abstract: A substrate for producing a soldering connection to a second substrate is disclosed. Soldering pads are distributed on the substrate surface. Solder balls can be applied to these pads. A soldering pad has a top side area and side areas connected to a conductor track. A soldering mask with openings in the region of the soldering pads is applied to the substrate. A soldering pad is provided with holding mechanism for the solder balls in such a way that, within the top side area of the soldering pad, a depression is introduced in the direction of the substrate or an elevation rising above the top side area is applied.

    10.
    发明专利
    未知

    公开(公告)号：DE10158770B4

    公开(公告)日：2006-08-03

    申请号：DE10158770

    申请日：2001-11-29

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： DOBRITZ STEPHAN ,  KAHLISCH KNUT ,  KROEHNERT STEFFEN

    IPC: H01L23/50 ,  H01L23/495

    Abstract: A leadframe of a conductive material includes a central region to accommodate a chip and a plurality of connecting fingers extending at least from one side in the direction of the central region, a contact region being provided adjacent to the central region on at least some of the connecting fingers. The course of the connecting fingers is such that a sectional face in an arbitrary imaginary cross-section at right angles to the main face of the leadframe has leadframe material. In such a case, it is attempted to keep cross-sections in a component without leadframe material as small as possible.

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