公开(公告)号：JP2002353174A

公开(公告)日：2002-12-06

申请号：JP2002099896

申请日：2002-04-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GLASHAUSER WALTER ,  UTESS BENNO ,  PURATH ANDREAS

IPC: B24B37/04 ,  B24B49/16 ,  B24B53/007 ,  H01L21/304 ,  B24B37/00 ,  B24B53/02

Abstract: PROBLEM TO BE SOLVED: To provide a method for adjusting the surface of a polishing pad (1) of chemical and mechanical polishing(CMP) of a semiconductor wafer, by measuring the current or voltage of a turntable (2) inputted to a motor (7) for rotating the polishing pad (1) to a rotated adjustment head (4). SOLUTION: The supply power (8) is used as the measure of actual wear for regeneration of the polishing pad (1). Since the polishing pad (1) is degraded generally by repetitive use, that is, contaminats are generated on a surface, wear efficiency is reduced. Therefore, by the method, in the case that a table current deviates from a limit for maintaining uniformity in the adjusting process, an alarm signal (11) is displayed. Especially corresponding to the alarm signal (11), rotation of the polishing pad (1) is accelerated or the pressurizing force or rotation of the adjustment head (4) is increased.