Abstract:
The invention relates to a memory-circuit arrangement (10) wherein parts of the memory are located on two different substrates. A memory cell field (16), amongst other things, is located on one substrate. A control switch (38), amongst other things, is located on the other substrate. The production costs thereof are significantly reduced due to the clever division of memory.
Abstract:
The invention relates to an interface arrangement (1) for exchanging data between a number of devices (3A, 3B) that has a freely configurable circuit logic (1A, 1B), which can be configured by the devices (3A, 3b) and once completely configured, enables a data exchange between the devices (3A, 3B) via the interface arrangement (1).
Abstract:
The garment has a sensor (S) for determining movement of an athlete body. Actuator (A) and/or indicator (D) convey a message in the form of optical or acoustic or tactile sensory signals to the athlete when the body movement sensed by the sensor exceeds a certain limit, for correcting the body posture. The sensor, actuator, and indicator connected by thin conductor threads are inserted in the canvas of the garment. The sensor is connected to an integrated circuit (IC) that is connected to a memory (M), which stores the sensor signals for future retroactive analysis.
Abstract:
The fabric (9) with two sets (3, 4) of electrically conductive threads and an insulating material is provided with a unit for monitoring the electrical state of the fabric. An independent claim is also included for an item of clothing which is made at least in parts of the proposed fabric.
Abstract:
A memory circuit arrangement and fabrication method thereof are presented in which the parts of the memory circuit arrangement are situated on two different substrates. An integrated memory cell array is situated on one substrate. An integrated control circuit that controls access to the memory cells is situated on the other (logic circuit) substrate. The control circuit controls sequences when reading, writing or erasing content of a memory cell. The logic circuit substrate also contains a CPU and encryption coprocessor. The memory circuit contains a sense amplifier, with the aid of which the memory state of a memory cell can be determined, and a decoding circuit that selects a word or bit line.
Abstract:
A memory circuit arrangement and fabrication method thereof are presented in which the parts of the memory circuit arrangement are situated on two different substrates. An integrated memory cell array is situated on one substrate. An integrated control circuit that controls access to the memory cells is situated on the other (logic circuit) substrate. The control circuit controls sequences when reading, writing or erasing content of a memory cell. The logic circuit substrate also contains a CPU and encryption coprocessor. The memory circuit contains a sense amplifier, with the aid of which the memory state of a memory cell can be determined, and a decoding circuit that selects a word or bit line.
Abstract:
Microprocessor card (2), e.g. a chip card, has a microcontroller (1) with a predefined functional scope and a configuration module (3) that is connected to the controller. The configuration module is a field-programmable gate array and is integrated in the controller.