Integrated half-bridge circuit esp. for control of automobile supply voltage to output load

    公开(公告)号:DE19946167A1

    公开(公告)日:2001-04-12

    申请号:DE19946167

    申请日:1999-09-27

    Abstract: An integrated semiconductor circuit arrangement includes a substrate (2) of a first conductivity type (p), on which are arranged at least one first zone (4) of a second conductivity type (n) for connection of a first supply potential (+U), and at least one second zone (6) of the second conductivity type (n) for connection of a second reference potential (A). A third zone (8) is arranged on the substrate (2) and is of the second conductivity type (n) for connection to an output terminal (A). A fourth zone (10) of the first conductivity type (p) is arranged between the first (4) and third (8) zones on the substrate, and a fifth zone (12) of the first conductivity type (p) is arranged on the substrate between the second (6) and the third (8) zones. Control electrodes (16,20) are separated from the fourth and fifth zones by insulation layers (18,22) and at least one control electrode (16) is arranged over the fourth zone (10) and at least one control electrode (20) is arranged over the fifth zone (12).

    7.
    发明专利
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    公开(公告)号:DE59510918D1

    公开(公告)日:2004-08-12

    申请号:DE59510918

    申请日:1995-07-25

    Abstract: The semiconductor component has a number of sheet metal mounting plates (30, 31, 32) contained within the insulating housing (4) and lying in a common plane. The mounting plates support the semiconductor switch elements (33-36) of a rectifier bridge, which are electrically coupled to the respective mounting plates. Pref., the housing contains 3 mounting plates, each formed integral with the terminal leads for the respective semicondcutor, provided by a single leadframe. The housing is pref. rectangular, with the terminal leads extending from the longitudinal housing sides.

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