Abstract:
The invention relates to a junction insulated lateral MOSFET for high/low side switches. A p-conductive wall (4) between an n- conductive source zone (2) and an n-conductive drain zone (3), together with the source zone (2) and drain zone (3), extend to a p-conductive substrate (1). The source zone (2) and the drain zone (3) are surrounded by a p-conductive area (5).
Abstract:
The invention relates to an SOI semi-conductor element comprising field electrodes and/or field zones which are arranged between a first and a second semi-conductor zone. Electric coupling is possible between the field electrodes and the field zones.
Abstract:
The invention relates to a controllable semiconductor switching element that blocks in both directions. Said semiconductor switching element comprises a first conduction region (12) and a second conduction region (14, 16) of a first type of conductivity (n, n+), a blocking region (18; 58) of a second type of conductivity (p) which is arranged between the first and second conduction regions (12, 14, 16), and a control electrode (20) which is arranged opposite the blocking region (18; 58) in an insulated manner. A recombination region is configured in the blocking region (18) and is comprised of a material that promotes a recombination of charge carriers of the first and second type of conductivity.
Abstract:
The invention relates to a low-resistance VDMOS semiconductor component and especially a VDMOS transistor or a vertical IGBT with a planar gate structure. A region (27) of the other conducting type is provided in the area of the bottom (26) pertaining to a trench (6). The region (27) surrounds said area. The trench (6) is at least partially filled with insulation material (31).
Abstract:
The invention relates to a re-usable implantation mask (5), preferably made of silicon, comprising specially structured trenches and holes(2 or 3), which is provided directly or at a distance from a device wafer (7). The invention also relates to a method for adjusting a further processing plane on an implantation plane in a semiconductor wafer (7) fitted with one such implementation mask.
Abstract:
The invention relates to a source-down power transistor in which narrow trenches (11) are provided between a source column (9) and a drain column (10). Said trenches are filled with insulated polysilicon (14). Inversion channels form on the lateral walls of the trenches in the instance of a positive drain voltage and a positive gate voltage. A current that can be controlled by the gate voltage flows inside said inversion channels.