公开(公告)号：DE10042839B4

公开(公告)日：2009-01-29

申请号：DE10042839

申请日：2000-08-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEER GOTTFRIED ,  SPITZLSPERGER WOLFGANG

IPC: H01L23/36 ,  H01L21/58 ,  H01L21/60 ,  H01L23/373 ,  H01L23/433 ,  H01L23/50 ,  H01L25/04

Abstract: The chip(s) (12-14) are arranged on a system substrate (2) with metallic track conductors (3). The substrate is located on a metal section (4) forming a heat sink (5). Its outer surface is exposed to the surrounding atmosphere (7). Its inner surface (8) supports the substrate. The inner surface of the metal section is electrically insulated from the tracks of the substrate by a metal oxide bonding layer. An Independent claim is included for the method of manufacture. The heat sink is oxidized, and the substrate is bonded to it. Chips are fixed to the substrate and bonded using wire or ball-grid array technology. The result is encapsulated, leaving the heat sink areas clear.

公开(公告)号：DE10042839A1

公开(公告)日：2002-04-04

申请号：DE10042839

申请日：2000-08-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEER GOTTFRIED ,  SPITZLSPERGER WOLFGANG

IPC: H01L23/373 ,  H01L23/433 ,  H01L23/36 ,  H01L23/50 ,  H01L21/58 ,  H01L21/60

Abstract: The chip(s) (12-14) are arranged on a system substrate (2) with metallic track conductors (3). The substrate is located on a metal section (4) forming a heat sink (5). Its outer surface is exposed to the surrounding atmosphere (7). Its inner surface (8) supports the substrate. The inner surface of the metal section is electrically insulated from the tracks of the substrate by a metal oxide bonding layer. An Independent claim is included for the method of manufacture. The heat sink is oxidized, and the substrate is bonded to it. Chips are fixed to the substrate and bonded using wire or ball-grid array technology. The result is encapsulated, leaving the heat sink areas clear.