公开(公告)号：DE19960249A1

公开(公告)日：2001-07-05

申请号：DE19960249

申请日：1999-12-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： UHLMANN RUEDIGER ,  NEU ACHIM ,  WEGE STEPHAN ,  STRUNTZ VOLKER

IPC: H01L21/60 ,  H01L21/607 ,  H01L23/498

Abstract: A method of producing a semiconductor device is described. The semiconductor device has a semiconductor chip with wiring terminals, conductor tracks for the electrical connection of the semiconductor chip, and a component of a housing configuration that contains organic, silicon-containing material. For this purpose, the semiconductor chip is applied to the component of the housing configuration and permanently connected to it. The conductor tracks and/or the wiring terminals are subsequently subjected to a cleaning process, in which silicon-containing material adhering to a surface is eliminated. The conductor tracks are subsequently connected in an electrically conducting manner to the wiring terminals. The contact quality of these electrical connections is noticeably improved by the cleaning process provided.