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    2.
    发明专利
    未知

    公开(公告)号：DE10024376A1

    公开(公告)日：2001-12-06

    申请号：DE10024376

    申请日：2000-05-17

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： WINDERL JOHANN ,  HAUSER CHRISTIAN ,  REISS MARTIN ,  MUENCH THOMAS ,  NEU ACHIM

    IPC: H01L23/31 ,  H01L23/16 ,  H01L21/00 ,  H01L23/50 ,  H01L21/56

    Abstract: The invention relates to a semi-conductor component, comprising a semi-conductor chip having contact pads on the first main surface area thereof. A wiring film is applied to the first main surface area, avoiding the contact pads. On the opposite side of the first main side of the semi-conductor chip, said wiring film has a solder stop mask which covers the conductors. Contact pads lying in at least one groove are wired to the adjacent ends of the conductors in order to connect the contact pads to the soldering contacts lying in the grooves of the solder stop mask. Each wire connection and the end of the conductor thereof is enveloped by a casting material. Said solder stop mask comprises at least one depression and one rise, enabling the casting material to be spread in a directed manner when applied to the semi-conductor component.

    6.
    发明专利
    未知

    公开(公告)号：DE10014304B4

    公开(公告)日：2007-08-02

    申请号：DE10014304

    申请日：2000-03-23

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： REIS MARTIN ,  WINDERL JOHANN ,  NEU ACHIM ,  HAUSER CHRISTIAN ,  NEUMAYER MARTIN

    IPC: H01L23/31 ,  H01L23/50

    Abstract: A semiconductor component includes a semiconductor chip having contact pads on its main face, and a wiring foil, in which are recesses for the contact pads, applied to the main face. The foil has conductor tracks on a side facing away from the main side. The conductor tracks connect the contact pads to solder contacts. The contact pads located in the recess are electrically connected via wire connections to adjacent conductor track ends. Each wire connection is surrounded with a sealing compound of a first and a second layer. A method for manufacturing a semiconductor component includes applying wiring foil to a main side of the chip, producing the wire connection between contact pads and adjacent conductor track ends, applying sealing compound to locations on the recess to completely cover the wire connection with the sealing compound, and only curing the surface of the sealing compound.

    8.
    发明专利
    未知

    公开(公告)号：DE19960249A1

    公开(公告)日：2001-07-05

    申请号：DE19960249

    申请日：1999-12-14

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： UHLMANN RUEDIGER ,  NEU ACHIM ,  WEGE STEPHAN ,  STRUNTZ VOLKER

    IPC: H01L21/60 ,  H01L21/607 ,  H01L23/498

    Abstract: A method of producing a semiconductor device is described. The semiconductor device has a semiconductor chip with wiring terminals, conductor tracks for the electrical connection of the semiconductor chip, and a component of a housing configuration that contains organic, silicon-containing material. For this purpose, the semiconductor chip is applied to the component of the housing configuration and permanently connected to it. The conductor tracks and/or the wiring terminals are subsequently subjected to a cleaning process, in which silicon-containing material adhering to a surface is eliminated. The conductor tracks are subsequently connected in an electrically conducting manner to the wiring terminals. The contact quality of these electrical connections is noticeably improved by the cleaning process provided.

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