Patent search ap:("INFINEON TECHNOLOGIES AG") AND inv:"TIAN FENG" Page 1

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发明专利
Semiconductor chip and process for forming a contact surface form the surface in a well against which a test needle can rest 未知

公开(公告)号：DE10159797A1

公开(公告)日：2003-03-13

申请号：DE10159797

申请日：2001-12-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： LINDOLF JUERGEN , WOHLRAB ERDMUTE , TIAN FENG , WEBER UDO

IPC: H01L23/485 , H01L23/58 , H01L21/66

Abstract: A process for forming a contact surface on a semiconductor chip onto which the point of a test board needle (1) can be placed comprises forming the surface (3) in a well (9) in the chip or wafer having a wall (10) bounding the contact surface against which the point of the needle can rest. An Independent claim is also included for a chip as above.

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