Photoresist Application
    2.
    发明申请
    Photoresist Application 有权
    光刻胶应用

    公开(公告)号:US20140272705A1

    公开(公告)日:2014-09-18

    申请号:US13833480

    申请日:2013-03-15

    CPC classification number: G03F7/168 G03F7/162

    Abstract: Devices and methods are provided where photoresist is applied on a substrate and at least some regions of the photoresist are dried prior to removing a substrate from a substrate support.

    Abstract translation: 提供了设备和方法,其中将光致抗蚀剂施加在基底上,并且在从衬底支撑件移除衬底之前将光致抗蚀剂的至少一些区域干燥。

    Photoresist application
    4.
    发明授权
    Photoresist application 有权
    光刻胶应用

    公开(公告)号:US09261791B2

    公开(公告)日:2016-02-16

    申请号:US13833480

    申请日:2013-03-15

    CPC classification number: G03F7/168 G03F7/162

    Abstract: Devices and methods are provided where photoresist is applied on a substrate and at least some regions of the photoresist are dried prior to removing a substrate from a substrate support.

    Abstract translation: 提供了设备和方法,其中将光致抗蚀剂施加在基底上,并且在从衬底支撑件移除衬底之前将光致抗蚀剂的至少一些区域干燥。

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