公开(公告)号：DE10157361A1

公开(公告)日：2003-03-13

申请号：DE10157361

申请日：2001-11-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ZUHR BERNHARD ,  WAIDHAUS BERND

IPC: H01L25/065 ,  H01L23/50 ,  H01L21/60

Abstract: Electronic component comprises large semiconductor chip (1) and small semiconductor chip (2), each with contact surfaces (3, 8) and bond wires (5, 7) for contacting with substrate (11) with wiring plane (6) with contact connecting surfaces (14) and outer contact surfaces (15). The semiconductor chips are arranged on the substrate and plastic filler (10) is provided between the substrate and the large semiconductor chip. An Independent claim is also included for a process for the production of the electronic component.