公开(公告)号：WO2005031867A3

公开(公告)日：2005-07-28

申请号：PCT/EP2004052093

申请日：2004-09-08

Applicant: INFINEON TECHNOLOGIES AG ,  GOLLER KLAUS ,  WENZEL ROLAND

Inventor： GOLLER KLAUS ,  WENZEL ROLAND

IPC: H01L23/522

CPC classification number: H01L23/5226 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention relates to a conductor track connection structure comprising a first conductor track (M1), a second conductor track (M2), and a plurality of connection elements (V) that electrically connect the first conductor track (M1) to the second conductor track (M2). According to the invention, the plurality of connection elements (V) is laterally embodied in at least one lateral region (S) of the first and second conductor tracks, in relation to an overlay alignment (I) of the conductor tracks, while a central region (Z) is free of connection elements (V). In this way, the electromigration properties of the connection structure are significantly improved and the current carrying capacity is increased.

Abstract translation: 本发明涉及一种具有一个第一互连（M1）的互连连接结构，第二导电线（M2）和多个连接构件（V）的，所述第一互连（M1）到第二互连（M2），其电互连。 多个根据本发明的相对于所述互连的横向在第一和第二互连的至少一个侧部（S）的覆盖对准（I）的连接构件（V）的形成，而中心区域（Z）是免费的连接元件（V）的。 以这种方式，互连结构可以显著提高载流能力的电迁移性能增加。

公开(公告)号：DE10344605A1

公开(公告)日：2005-05-04

申请号：DE10344605

申请日：2003-09-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WENZEL ROLAND ,  GOLLER KLAUS

IPC: H01L23/522 ,  H01L23/528

Abstract: An interconnect connection structure having first and second interconnects and multiple connection elements that electrically connect the first interconnect to the second interconnect is described. The multiple connection elements are formed laterally in a lateral region of the first and second interconnects relative to an overlay orientation of the interconnects. A central region may be free of connection elements so that electro-migration properties of the connection structure are improved and the current-carrying capacity is increased.

公开(公告)号：DE10253626A1

公开(公告)日：2004-06-03

申请号：DE10253626

申请日：2002-11-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER KLAUS ,  WENZEL ROLAND

IPC: H01L23/544 ,  G01R31/28 ,  H01L21/66 ,  H01L23/528

Abstract: Additional planar structures are arranged closely adjacent to each other around a via (4) or contact hole and the corresponding conductive track (2), within the uppermost and/or the underlying conductive track (2) of the metallization plane. The structures are dummy structures with or without circuit functions, e.g. dummy tracks.

公开(公告)号：DE10247486A1

公开(公告)日：2004-04-22

申请号：DE10247486

申请日：2002-10-11

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER KLAUS ,  MUELLER MARC ,  WENZEL ROLAND

IPC: H01L23/544 ,  H01L21/66

Abstract: A test structure to give process exactness in the production of aligned structures on substrates comprises two test patterns (801,803) produced using two masks which have four overlapping sections (8011-8014,8031-8034) which allow process displacement in four different directions. An Independent claim is also included for a process to produce exact alignment as above.

公开(公告)号：DE10344605B4

公开(公告)日：2008-09-18

申请号：DE10344605

申请日：2003-09-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WENZEL ROLAND ,  GOLLER KLAUS

IPC: H01L23/528 ,  H01L21/768 ,  H01L23/522 ,  H05K1/11

Abstract: An interconnect connection structure having first and second interconnects and multiple connection elements that electrically connect the first interconnect to the second interconnect is described. The multiple connection elements are formed laterally in a lateral region of the first and second interconnects relative to an overlay orientation of the interconnects. A central region may be free of connection elements so that electro-migration properties of the connection structure are improved and the current-carrying capacity is increased.