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公开(公告)号：DE50304559D1
公开(公告)日：2006-09-21
申请号：DE50304559
申请日：2003-10-16
Applicant: INFINEON TECHNOLOGIES AG
Inventor： GOLLER KLAUS , WENZEL ROLAND DR
IPC: H01L23/544 , H01L23/522 , H01L23/528
Abstract: Additional planar structures are arranged closely adjacent to each other around a via (4) or contact hole and the corresponding conductive track (2), within the uppermost and/or the underlying conductive track (2) of the metallization plane. The structures are dummy structures with or without circuit functions, e.g. dummy tracks.
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