公开(公告)号：JP2005354095A

公开(公告)日：2005-12-22

申请号：JP2005209309

申请日：2005-07-19

Applicant: Infineon Technologies Ag ,  インフィネオン テクノロジーズ アクチエンゲゼルシャフト

Inventor： BAST ULRICH ,  OECHSNER MATTHIAS ,  ERNST GEORG ,  ZEILER THOMAS

IPC: H01L23/12 ,  H01L21/56 ,  H01L23/00 ,  H01L23/13 ,  H01L23/15 ,  H01L23/28 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To provide a device and a method for packing electronic components using injection moulding technology.
SOLUTION: A plurality of components 1 are arranged in predetermined positions on a first side 2 of a subcarrier 3. The subcarrier 3 has printed conductors 5 with contact surfaces 6 for connecting to the contact surfaces 7 of the electronic components 1 and through contacts 8 to external contacts on a second side 10 of the subcarrier 3. The subcarrier 3 consists of a ceramic substrate 11 which in its edge areas 12 on the first side 2, has a ductile metal layer 13 arranged in a ring shape.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种使用注射成型技术包装电子部件的装置和方法。 解决方案：多个部件1布置在子载波3的第一侧2上的预定位置。子载波3具有印刷导体5，其具有用于连接到电子部件1的接触表面7的接触表面6并且通过 触点8与子载波3的第二侧10上的外部触点相连。副载波3由陶瓷基板11构成，陶瓷基板11在其第一面2上的边缘区域12中具有以环形布置的延性金属层13。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：WO0165601A3

公开(公告)日：2002-06-20

申请号：PCT/DE0100778

申请日：2001-03-02

Applicant: INFINEON TECHNOLOGIES AG ,  BAST ULRICH ,  OECHSNER MATTHIAS ,  ERNST GEORG ,  ZEILER THOMAS

Inventor： BAST ULRICH ,  OECHSNER MATTHIAS ,  ERNST GEORG ,  ZEILER THOMAS

IPC: H01L23/12 ,  H01L21/56 ,  H01L23/00 ,  H01L23/13 ,  H01L23/15 ,  H01L23/28 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: The invention relates to a device and a method for packing electronic components (1) using injection moulding technology. A number of components (1) are arranged in predetermined positions on a first side (2) of a subcarrier (3), said subcarrier (3) having printed conductors with contact surfaces (6) for connecting to the contact surfaces (7) of the electronic components (1) and through contacts (8) to external contacts on a second side (10) of the subcarrier (3). The subcarrier (3) consists of a ceramic substrate (11) which in its edge areas (12) on the first side (2), has a ductile metal layer (13) arranged in a ring shape.

Abstract translation: 装置和方法，用于包装电子元件（1）通过注射成型技术的手段。 为了这个目的，多个在第一侧部件（1）的（2）的中间载体（3）被布置在预定位置，并且中间支撑件（3）具有导体轨迹（5）具有接触垫（6），用于连接到接触表面（7）的 电子部件（1），并通过中间载体上的触点（8）到外部触点上的第二侧（10）（3）。 在此，所述中间支撑件（3）由陶瓷基体（11），其在所述第一侧（2）的其边缘区域（12）具有可延展的环形布置的金属层（13）的。

公开(公告)号：WO2005008772A3

公开(公告)日：2005-08-11

申请号：PCT/DE2004001150

申请日：2004-06-04

Applicant: INFINEON TECHNOLOGIES AG ,  ERNST GEORG ,  GROENINGER HORST ,  JEREBIC SIMON ,  ZEILER THOMAS

Inventor： ERNST GEORG ,  GROENINGER HORST ,  JEREBIC SIMON ,  ZEILER THOMAS

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L21/4842 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to an electronic component (1) comprising a semiconductor chip (2) and a flat conductor frame (17) provided on the lower face thereof with a metal coating pattern (19) for soldering the electronic component (1). Said metal coating pattern (19) comprises wetting areas which are wettable with a soldering material and non-wetting areas (20) which are non-wettable by said soldering material. The inventive electronic component (1) is provided on the low face thereof with solder depositions (15) in the wetting areas thereof.

Abstract translation: 本发明涉及包括半导体芯片（2）和具有Belotung到电子部件（1）的扁平导体框架（17）的电子部件（1）是在其下侧的金属涂层图案（19）。 该金属涂层图案（19）包括润湿区域（21），其可与焊接材料被浸湿，抗湿区域（20），它们是不润湿的焊料，其特征在于，所述电子部件（1）上的部件的下侧的润湿区域（21） 焊料沉积物（15）。

公开(公告)号：WO02099871A3

公开(公告)日：2003-03-06

申请号：PCT/DE0202044

申请日：2002-06-05

Applicant: INFINEON TECHNOLOGIES AG ,  WOERZ ANDREAS ,  ZEILER THOMAS

Inventor： WOERZ ANDREAS ,  ZEILER THOMAS

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L21/565 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to a plastic housing (14) comprising several semiconductor chips (3) and a wiring modification plate (11), on which the semiconductor chips (3) are arranged, and to an injection moulding-mould for producing said plastic housing (14), in addition to an electronic component, which can be produced by the combination of the injection-moulding mould, wiring modification plate (11) and plastic housing (14). The invention also relates to a method, which uses the inventive wiring modification plate (11) and the two-part injection-moulding mould, to produce a plastic housing of this type (14) comprising several semiconductor chips (3) for several electronic components.

Abstract translation: 本发明涉及一种具有多个半导体芯片（3）的塑料外壳（14）和重新布线（11），在其上（3）被布置在半导体芯片，和一注射模具用于制造塑料壳体（14）和电子部件中，与所述辅助 注射模具，重新布线（11）和塑料外壳（14）的组合被产生。 此外，本发明涉及使用本发明的再布线（11）和两部分组成的注塑模的方法允许具有多个半导体芯片（3），用于多个电子部件的例如塑料壳体的制造（14）。

公开(公告)号：WO0109940A2

公开(公告)日：2001-02-08

申请号：PCT/DE0002502

申请日：2000-07-28

Applicant: INFINEON TECHNOLOGIES AG ,  ERNST GEORG ,  ZEILER THOMAS

Inventor： ERNST GEORG ,  ZEILER THOMAS

IPC: H01L21/56

CPC classification number: H01L21/565 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: The invention relates to a method for coating electronic components (1) that are mounted on a substrate (2) by means of a molding tool. Said molding tool comprises at least one cavity (5) that is defined by two molding elements (3, 4). For the inventive method, either flexible pressure elements (8, 9, 13, 14) or auxiliary substrates (19) are used to seal the cavity (5) and to compensate for work tolerances and differences in thickness of the substrate (2).

Abstract translation: 是对于具有至少两个成形元件包装电子元件（1）到（2）被安装，形成的载体基板由Moldwerkzeuges的装置（3，4）空腔（5）是可挠性压力元件（8，9，13， 14）或副载体（19），借助于所述副载体（19），所述腔体（5）的密封和所述载体基底（2）的厚度差的制造公差和补偿的补偿。

公开(公告)号：DE10012880A1

公开(公告)日：2001-09-27

申请号：DE10012880

申请日：2000-03-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ZEILER THOMAS ,  ERNST GEORG

IPC: H01L21/56 ,  H01L21/68 ,  C09J183/04 ,  H01L23/31 ,  H01L23/50

Abstract: Process for encapsulating semiconductor chips (7) comprises applying an adhering film on the lower side of the system carrier before injecting a pressed composition so that the surfaces of the carrier covered with the film are kept free from the pressed composition. An Independent claim is also included for a device for encapsulating semiconductor chips comprising a conveyor (21) for moving a film (24) over the bearing surface (28) for the system carrier; and a heater (25) for heating the foil to make it easier to remove from the carrier. A film with an adhesive layer is used.

公开(公告)号：DE10010461A1

公开(公告)日：2001-09-13

申请号：DE10010461

申请日：2000-03-03

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAST ULRICH ,  OECHSNER MATTHIAS ,  ERNST GEORG ,  ZEILER THOMAS

IPC: H01L23/12 ,  H01L21/56 ,  H01L23/00 ,  H01L23/13 ,  H01L23/15 ,  H01L23/28 ,  H01L23/31 ,  H01L23/498

Abstract: Process for packing electronic components comprises preparing a ceramic substrate (11) with conducting pathways (5), contact connection surfaces (6) and pressure contacts (8); preparing an injection molding tool (20) forming the housing mold; pressing the tool onto a ductile annular metal layer (13) in the edge region of the substrate; injecting a plastic composition in the hollow chamber (25) between the molding tool and the components on the first side of the substrate; applying contact outer connection surfaces in predetermined positions of a second side of the substrate; and separating the components. An Independent claim is also included for a device for packing electronic components. Preferred Features: The ceramic substrate is made from finely ground Al2O3 having a purity of at least 96% and containing small amounts of MgO.

公开(公告)号：DE10332017A1

公开(公告)日：2005-03-03

申请号：DE10332017

申请日：2003-07-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ZEILER THOMAS ,  JEREBIC SIMON ,  ERNST GEORG ,  GROENINGER HORST

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/495

Abstract: An electronic component includes a semiconductor chip and a leadframe. The leadframe includes a metal coating pattern on its underside to facilitate the application of solder to the electronic component. The metal coating pattern includes wetting regions that are wettable with solder material and anti-wetting regions that are unwettable with solder material, and the electronic component includes solder deposits formed on the wetting regions on the underside of the component.

公开(公告)号：DE10063041B4

公开(公告)日：2012-12-06

申请号：DE10063041

申请日：2000-12-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ERNST GEORG ,  GROENINGER HORST ,  ZEILER THOMAS

IPC: H01L21/60 ,  H01L21/56 ,  H01L23/28 ,  H01L23/31 ,  H01L23/50

Abstract: Verfahren zum Herstellen einer integrierten Leadless-Gehäuse-Schaltung, das folgende Schritte aufweist: – Bereitstellen eines Leadframe-Rahmens (1) mit einer Oberseite und einer Unterseite und wenigstens einem Leadframe-Abschnitt (2, 3, 4, 5), der mit einem von einem Kunststoffgehäuse (6) umgebenen Halbleiterbauteil versehen ist, wobei als Leiterbahnen (7) ausgebildete Bereiche des Leadframe-Abschnitts (2, 3, 4, 5) eine äußere Oberfläche des Kunststoffgehäuses (6) durchdringen, wobei vor einem Schritt eines Durchtrennens der Leiterbahnen (7) zum Singulieren einer integrierten Schaltung der folgende Schritt vorgesehen ist: – Beaufschlagen wenigstens eines Übergangsbereichs zwischen Kunststoffgehäuse (6) und Leiterbahnen (7) mit energiereicher Strahlung von der Ober- und Unterseite des Leadframe-Rahmens, und zwar derart, dass im Übergangsbereich Teile des Kunststoffgehäuses (6) entfernt werden, – Durchtrennen der Leiterbahnen (7) zum Singulieren der integrierten Leadless-Gehäuse-Schaltung unter Erzeugen von Trennflächen (10), so dass zwischen jeder Trennfläche (10) und einem Bereich des die betreffende Trennfläche (10) umgebenden Kunststoffgehäuses (6) in Draufsicht auf...

公开(公告)号：DE10126508B4

公开(公告)日：2008-11-13

申请号：DE10126508

申请日：2001-05-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAST ULRICH ,  ERNST GEORG ,  ZEILER THOMAS ,  OECHSNER MATTHIAS

IPC: H01L21/50 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/15