公开(公告)号：DE60003703T2

公开(公告)日：2004-04-22

申请号：DE60003703

申请日：2000-09-05

Applicant: INFINEON TECHNOLOGIES CORP ,  IBM

Inventor： NOJO HARUKI ,  SCHUTZ J ,  RAMACHANDRAN RAVIKUMAR

IPC: B24B37/00 ,  C09G1/02 ,  H01L21/304 ,  H01L21/3105

Abstract: An aqueous slurry-less composition for chemical-mechanical-polishing of a silicon dioxide workpiece comprising: a cationic surfactant that is soluble and ionized at neutral to alkaline pH conditions, in which the cationic surfactant is present in an aqueous slurry-less composition in an amount less than its critical micelle concentration.

公开(公告)号：DE60003703D1

公开(公告)日：2003-08-07

申请号：DE60003703

申请日：2000-09-05

Applicant: INFINEON TECHNOLOGIES CORP ,  IBM

Inventor： NOJO HARUKI ,  SCHUTZ J ,  RAMACHANDRAN RAVIKUMAR

IPC: B24B37/00 ,  C09G1/02 ,  H01L21/304 ,  H01L21/3105

Abstract: An aqueous slurry-less composition for chemical-mechanical-polishing of a silicon dioxide workpiece comprising: a cationic surfactant that is soluble and ionized at neutral to alkaline pH conditions, in which the cationic surfactant is present in an aqueous slurry-less composition in an amount less than its critical micelle concentration.