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1.发明申请STRUCTURES WITH SURFACE-EMBEDDED ADDITIVES AND RELATED MANUFACTURING METHODS 审中-公开具有表面嵌入添加剂的结构和相关制造方法
公开(公告)号：WO2011106730A3
公开(公告)日：2011-12-01
申请号：PCT/US2011026362
申请日：2011-02-25
Applicant: INNOVA DYNAMICS INC , MITTAL ALEXANDER CHOW , SRINIVAS ARJUN DANIEL , ROBINSON MATTHEW R , YOUNG MICHAEL EUGENE
IPC: H01B5/14
CPC classification number: H01B1/22 , B05D1/005 , B05D3/007 , H01L23/373 , H01L31/022466 , H01L31/035209 , H01L31/1884 , H01L51/442 , H01L51/5206 , H01L2924/0002 , H05K1/0271 , H05K1/097 , Y02E10/50 , Y10T428/24364 , Y10T428/24372 , Y10T428/249921 , Y10T428/25 , H01L2924/00
Abstract: Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
Abstract translation: 导电或半导体添加剂被嵌入主体材料的表面以用于各种应用和装置中。 所得的表面嵌入结构表现出改善的性能，以及由其组成和制造工艺产生的成本优势。
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公开(公告)号：CA2734864A1
公开(公告)日：2010-02-25
申请号：CA2734864
申请日：2009-08-21
Applicant: INNOVA DYNAMICS INC
Inventor： YOUNG MICHAEL EUGENE , MITTAL ALEXANDER CHOW , SRINIVAS ARJUN DANIEL , PENG CALVIN
Abstract: Disclosed are methods for incorporating additives, such as chemically active particles, into the surfaces of articles or into coatings disposed atop articles. The disclosed methods are also applicable to conventional molding techniques, and can be performed in batch or continuous fashion.
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公开(公告)号：AU2011289620A1
公开(公告)日：2013-03-21
申请号：AU2011289620
申请日：2011-08-08
Applicant: INNOVA DYNAMICS INC
IPC: H01L31/048
Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
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公开(公告)号：HK1159023A1
公开(公告)日：2012-07-27
申请号：HK11113546
申请日：2011-12-15
Applicant: INNOVA DYNAMICS INC
Inventor： YOUNG MICHAEL EUGENE , MITTAL ALEXANDER CHOW , SRINIVAS ARJUN DANIEL , PENG CALVIN
IPC: B28B20060101 , B05D20060101
Abstract: A method of modifying a coating material includes applying a fluid including a population of particles to a wet coating material disposed on a substrate. The method also includes drying the wet coating material so as to give rise to a coated article, where the particles are at least partially embedded in a surface of the dried coating material. The particles can be metallic nanowires, and a loading of the metallic nanowires in the dried coating material can be above an electric percolation threshold.
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公开(公告)号：CA2829242A1
公开(公告)日：2012-02-16
申请号：CA2829242
申请日：2011-08-08
Applicant: INNOVA DYNAMICS INC
IPC: H01L31/048
Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
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Patent Agency Ranking
公开(公告)号：AU2011220397A1
公开(公告)日：2012-10-18
申请号：AU2011220397
申请日：2011-02-25
Applicant: INNOVA DYNAMICS INC
IPC: H01B5/14
Abstract: Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
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公开(公告)号：HK1149286A1
公开(公告)日：2011-09-30
申请号：HK11103577
申请日：2011-04-08
Applicant: INNOVA DYNAMICS INC
Inventor： SRINIVAS ARJUN DANIEL , PENG CALVIN , MITTAL ALEXANDER CHOW , AGARWAL PRIYANKA
IPC: C08J20060101 , B05D20060101
Abstract: Provided are surfaces comprising particles, which particles may possess, for example, antimicrobial or biosensing properties. Also provided are related methods for fabrication of the inventive articles. Also provided are systems and methods for treating fluids, objects, and targets with the inventive surfaces.
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公开(公告)号：EP2539904A4
公开(公告)日：2018-01-10
申请号：EP11748200
申请日：2011-02-25
Applicant: INNOVA DYNAMICS INC
IPC: H01B5/14 , H01L31/0224
CPC classification number: H01B1/22 , B05D1/005 , B05D3/007 , H01L23/373 , H01L31/022466 , H01L31/035209 , H01L31/1884 , H01L51/442 , H01L51/5206 , H01L2924/0002 , H05K1/0271 , H05K1/097 , Y02E10/50 , Y10T428/24364 , Y10T428/24372 , Y10T428/249921 , Y10T428/25 , H01L2924/00
Abstract: Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
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公开(公告)号：AU2011289620B2
公开(公告)日：2014-02-13
申请号：AU2011289620
申请日：2011-08-08
Applicant: INNOVA DYNAMICS INC
IPC: H01L31/048
Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
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公开(公告)号：CA2828468A1
公开(公告)日：2011-09-01
申请号：CA2828468
申请日：2011-02-25
Applicant: INNOVA DYNAMICS INC
IPC: H01B5/14
Abstract: Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
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