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1.发明申请STRUCTURES WITH SURFACE-EMBEDDED ADDITIVES AND RELATED MANUFACTURING METHODS 审中-公开具有表面嵌入添加剂的结构和相关制造方法
公开(公告)号：WO2011106730A3
公开(公告)日：2011-12-01
申请号：PCT/US2011026362
申请日：2011-02-25
Applicant: INNOVA DYNAMICS INC , MITTAL ALEXANDER CHOW , SRINIVAS ARJUN DANIEL , ROBINSON MATTHEW R , YOUNG MICHAEL EUGENE
IPC: H01B5/14
CPC classification number: H01B1/22 , B05D1/005 , B05D3/007 , H01L23/373 , H01L31/022466 , H01L31/035209 , H01L31/1884 , H01L51/442 , H01L51/5206 , H01L2924/0002 , H05K1/0271 , H05K1/097 , Y02E10/50 , Y10T428/24364 , Y10T428/24372 , Y10T428/249921 , Y10T428/25 , H01L2924/00
Abstract: Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
Abstract translation: 导电或半导体添加剂被嵌入主体材料的表面以用于各种应用和装置中。 所得的表面嵌入结构表现出改善的性能，以及由其组成和制造工艺产生的成本优势。
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公开(公告)号：WO2013029028A9
公开(公告)日：2014-04-17
申请号：PCT/US2012052396
申请日：2012-08-24
Applicant: INNOVA DYNAMICS INC
Inventor： SRINIVAS ARJUN DANIEL , ROBINSON MATTHEW R , MITTAL ALEXANDER , YOUNG MICHAEL EUGENE , BUCHANAN DAVID , GEORGE JOSEPH , YOSHIOKA YUKA
CPC classification number: H05K1/0274 , B82Y30/00 , G06F3/041 , G06F2203/04103 , H05K1/0296 , H05K1/0298 , H05K1/09 , H05K3/0091 , H05K3/027 , Y10S977/932 , Y10T428/25 , Y10T428/254
Abstract: A patterned transparent conductor includes a substrate and additives at least partially embedded into at least one surface of the substrate and localized adjacent to the surface according to a pattern to form higher sheet conductance portions. The higher sheet conductance portions are laterally adjacent to lower sheet conductance portions.
Abstract translation: 图案化的透明导体包括基材和至少部分地嵌入基材的至少一个表面中并且根据图案邻近表面定位的添加剂，以形成更高的片状导电部分。 较高的片材导电部分与下片材导电部分横向相邻。
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公开(公告)号：CA2734864A1
公开(公告)日：2010-02-25
申请号：CA2734864
申请日：2009-08-21
Applicant: INNOVA DYNAMICS INC
Inventor： YOUNG MICHAEL EUGENE , MITTAL ALEXANDER CHOW , SRINIVAS ARJUN DANIEL , PENG CALVIN
Abstract: Disclosed are methods for incorporating additives, such as chemically active particles, into the surfaces of articles or into coatings disposed atop articles. The disclosed methods are also applicable to conventional molding techniques, and can be performed in batch or continuous fashion.
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公开(公告)号：AU2011220397A1
公开(公告)日：2012-10-18
申请号：AU2011220397
申请日：2011-02-25
Applicant: INNOVA DYNAMICS INC
IPC: H01B5/14
Abstract: Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
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公开(公告)号：AU2011289620A1
公开(公告)日：2013-03-21
申请号：AU2011289620
申请日：2011-08-08
Applicant: INNOVA DYNAMICS INC
IPC: H01L31/048
Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
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Patent Agency Ranking
公开(公告)号：CA2849394A1
公开(公告)日：2013-02-28
申请号：CA2849394
申请日：2012-08-24
Applicant: INNOVA DYNAMICS INC
Inventor： SRINIVAS ARJUN DANIEL , ROBINSON MATTHEW R , MITTAL ALEXANDER , YOUNG MICHAEL EUGENE , BUCHANAN DAVID , GEORGE JOSEPH , YOSHIOKA YUKA
Abstract: A patterned transparent conductor includes a substrate and additives at least partially embedded into at least one surface of the substrate and localized adjacent to the surface according to a pattern to form higher sheet conductance portions. The higher sheet conductance portions are laterally adjacent to lower sheet conductance portions.
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公开(公告)号：HK1159023A1
公开(公告)日：2012-07-27
申请号：HK11113546
申请日：2011-12-15
Applicant: INNOVA DYNAMICS INC
Inventor： YOUNG MICHAEL EUGENE , MITTAL ALEXANDER CHOW , SRINIVAS ARJUN DANIEL , PENG CALVIN
IPC: B28B20060101 , B05D20060101
Abstract: A method of modifying a coating material includes applying a fluid including a population of particles to a wet coating material disposed on a substrate. The method also includes drying the wet coating material so as to give rise to a coated article, where the particles are at least partially embedded in a surface of the dried coating material. The particles can be metallic nanowires, and a loading of the metallic nanowires in the dried coating material can be above an electric percolation threshold.
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公开(公告)号：CA2829242A1
公开(公告)日：2012-02-16
申请号：CA2829242
申请日：2011-08-08
Applicant: INNOVA DYNAMICS INC
IPC: H01L31/048
Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
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9.发明公开TRANSPARENT CONDUCTORS INCORPORATING ADDITIVES AND RELATED MANUFACTURING METHODS 审中-公开根据上述制造添加剂和过程的透明导体
公开(公告)号：EP2727165A4
公开(公告)日：2015-08-05
申请号：EP12804628
申请日：2012-06-28
Applicant: INNOVA DYNAMICS INC
Inventor： SRINIVAS ARJUN DANIEL , ROBINSON MATTHEW R , YOUNG MICHAEL EUGENE
CPC classification number: H01B1/02 , G02F1/13439 , G06F3/044 , G06F3/045 , H01B13/30 , H01L51/0021 , H01L51/5206 , H01L2251/5369
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公开(公告)号：EP2539904A4
公开(公告)日：2018-01-10
申请号：EP11748200
申请日：2011-02-25
Applicant: INNOVA DYNAMICS INC
IPC: H01B5/14 , H01L31/0224
CPC classification number: H01B1/22 , B05D1/005 , B05D3/007 , H01L23/373 , H01L31/022466 , H01L31/035209 , H01L31/1884 , H01L51/442 , H01L51/5206 , H01L2924/0002 , H05K1/0271 , H05K1/097 , Y02E10/50 , Y10T428/24364 , Y10T428/24372 , Y10T428/249921 , Y10T428/25 , H01L2924/00
Abstract: Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
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