POWER MODULE AND ITS ASSEMBLING METHOD
    1.
    发明专利

    公开(公告)号:JP2003197862A

    公开(公告)日:2003-07-11

    申请号:JP2002359836

    申请日:2002-12-11

    Abstract: PROBLEM TO BE SOLVED: To provide an intelligent motor drive module with a molded package. SOLUTION: The power module having a lead frame with a plurality of power switching devices Q1 to Q6 and a plurality of driving devices 14, 16, and 18 mounted thereupon. The driving devices control the power switching devices to provide power to a plurality of output leads via first wire bonds. The first wire bonds are substantially parallel to each other between the power switching devices and the output leads. The lead frame and power switching devices are enclosed in a molded package. COPYRIGHT: (C)2003,JPO

    H-BRIDGE WITH SINGLE LEAD FRAME
    3.
    发明专利

    公开(公告)号:AU2003207531A1

    公开(公告)日:2003-09-22

    申请号:AU2003207531

    申请日:2003-01-13

    Abstract: A fully protected H-bridge for a d-c motor consists of two high side MOSFETs and a control and logic IC on a first conductive heat sink all within a first package and two discrete low side MOSFETs. The entire bridge is controlled by the IC. Shoot thru protection is provided for each leg, and a PMW soft start sequence is provided through the control of the low side MOSFETs, programed by an external, chargeable RC circuit. Input signals to the high side MOSFETs select the operation modes. Protective circuits are provided for short circuit current and over current conditions. Sleep mode and braking/non braking control is also provided.

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