ELECTRODEPOSITION METHOD FOR PREPARING POLYCRYSTALLINE COPPER HAVING IMPROVED MECHANICAL AND PHYSICAL PROPERTIES
    5.
    发明申请
    ELECTRODEPOSITION METHOD FOR PREPARING POLYCRYSTALLINE COPPER HAVING IMPROVED MECHANICAL AND PHYSICAL PROPERTIES 审中-公开
    用于制备具有改进的机械和物理性能的多晶铜的电沉积方法

    公开(公告)号:US20160208369A1

    公开(公告)日:2016-07-21

    申请号:US15003259

    申请日:2016-01-21

    CPC classification number: C22F1/08 C21D1/06 C21D9/0068 C25D3/12 C25D3/38 C25D5/50

    Abstract: Polycrystalline materials are prepared by electrodeposition of a precursor material that is subsequently heat-treated to induce at least a threefold increase in the grain size of the material to yield a relatively high fraction of ‘special’ low Σ grain boundaries and a randomized crystallographic texture. The precursor metallic material has sufficient purity and a fine-grained microstructure (e.g., an average grain size of 4 nm to 5 pm). The resulting metallic material is suited to the fabrication of articles requiring high mechanical or physical isotropy and/or resistance to grain boundary-mediated deformation or degradation mechanisms.

    Abstract translation: 多结晶材料通过电沉积前体材料制备,随后进行热处理以诱导材料的晶粒尺寸至少增加三倍,从而产生相对较高的“特殊”低Sgr; 晶界和随机晶体学结构。 前体金属材料具有足够的纯度和细晶粒微结构(例如,平均粒度为4nm至5μm)。 所得到的金属材料适于制造需要高机械或物理各向同性的物品和/或对晶界介导的变形或降解机理的抵抗力。

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