公开(公告)号：MY131938A

公开(公告)日：2007-09-28

申请号：MYPI20022983

申请日：2002-08-09

Applicant: INTEL CORP

Inventor： MCCORMICK CAROLYN ,  JESSEP REBECCA ,  DUNGAN JOHN ,  BOGGS DAVID W ,  SATO DARYL

IPC: H01L23/498 ,  H05K1/11 ,  H05K3/34

Abstract: AN ARRANGEMENT OF PADS (14, 20, 22) WITH SELECTIVE VIA (24) IN PAD (14, 20, 22) FOR MOUNTING A SEMICONDUCTOR PACKAGE (12) ON A SUBSTRATE (18).IN ORDER TO STRENGTHEN THE SOLDERED BONDS, STANDARD PADS (14, 20, 22), WHICH HAVE A STRONGER BOND, ARE USED IN LOCATIONS OF GREATEST STRESS AND DEFLECTION. VIAS (24) IN PAD (VIP) ARE USED AT ALL OTHER LOCATIONS TO IMPROVE ROUTING ADVANTAGES DUE TO THEIR SMALLER SURFACE AREA.(FIG 3)

公开(公告)号：MY134087A

公开(公告)日：2007-11-30

申请号：MYPI20032217

申请日：2003-06-13

Applicant: INTEL CORP

Inventor： BOGGS DAVID W ,  SATO DARYL A ,  DUNGAN JOHN H ,  PAEK GARY I

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/46

Abstract: AN ELECTRONIC ASSEMBLY (10) IS DISCLOSED. THE ELECTRONIC ASSEMBLY (10) INCLUDES A LOWER PORTION (28) AND A FIRST ELONGATE TRACE (32) FORMED ON AN UPPER SURFACE OF THE LOWER PORTION (28). THE TRACE (32) IS COVERED BY AN UPPER PORTION (26), AND AN OPENING (18) FORMED THROUGH AN UPPER SURFACE OF THE UPPER PORTION (26) EXTENDS TO THE TRACE (32) TO EXPOSE A PORTION OF THE TRACE (32).A SECOND ELONGATE TRACE (20) IS FORMED ON THE UPPER PORTION (26). A PORTION OF THE SECOND ELONGATE TRACE (20) POSITIONED IN THE OPENING (18) FORMED THROUGH THE UPPER SURFACE OF THE UPPER PORTION (26) CONTACTS THE FIRST ELONGATE TRACE (32) THROUGH THE OPENING (18) TO FORM AN ELECTRICAL INTERCONNECTION (46) BETWEEN THE FIRST TRACE (32) AND THE SECOND TRACE (20).(FIG 7)

公开(公告)号：MY129382A

公开(公告)日：2007-03-30

申请号：MYPI20022939

申请日：2002-08-07

Applicant: INTEL CORP

Inventor： BOGGS DAVID W ,  JESSEP REBECCA ,  MCCORMICK CAROLYN ,  SATO DARYL ,  DUNGAN JOHN

IPC: B32B3/10 ,  H05K1/02 ,  H05K3/34

Abstract: A REGISTRATION COUPON (20) IS PROVIDED FOR A PRINTED CIRCUIT BOARD (10) OR OTHER SUBSTRATE.THE REGISTRATION COUPON (20) MAY BE USED TO DETERMINE A HOLE-TO-OUTER LAYER FEATURE REGISTRATION AND A SOLDER MASK REGISTRATION. THE REGISTRATION COUPON (20) MAY INCLUDE A REGISTRATION HOLE PROVIDED ON THE CIRCUIT BOARD (10), A METAL PAD AND AN ANTI-PAD (40) PROVIDED ON THE CIRCUIT BOARD (10) ABOUT THE REGISTRATION HOLE (30), AND A SOLDER MASK (70) COVERING THE METAL PAD.(FIG 2)