公开(公告)号：AT362137T

公开(公告)日：2007-06-15

申请号：AT03749266

申请日：2003-08-29

Applicant: INTEL CORP

Inventor： LEBIZAY GERALD ,  PEEBLES BRIAN ,  GISH DAVID ,  MASSA DON ,  GERBEHY JAY

IPC: G06F13/40 ,  G06F13/00 ,  H04L12/40 ,  H05K7/14

Abstract: Multiple boards are connected within a chassis, using a multi-port Target Channel Adapter (TCA). Data is transported from a TCA on a board directly to a TCA on another board through a meshed backplane. The meshed backplane is equipped to mount boards via connectors and may consist of a fabric of copper conductors or optical fibers. Communication from TCA to TCA requires placing ports on each individual TCA along with the appropriate input and output buffering. A multi-port TCA capable of performing multiple bridging functions simultaneously i.e., bridging from a high speed serial meshed backplane to multiple local busses, i.e., Gigabit Ethernet, Fibre Channel, and TCP/IP devices, is referred to as a Fabric Interconnect Chip (FIC).

公开(公告)号：AT478508T

公开(公告)日：2010-09-15

申请号：AT03781950

申请日：2003-11-12

Applicant: INTEL CORP

Inventor： LEBIZAY GERALD ,  GISH DAVID ,  OLIVER NEAL

IPC: H04L29/06

Abstract: Techniques for performing protocol translation for a modular system may be described. In some examples, a first packet created in accordance with a first protocol may be received. A packet type for the first packet may be determined, a second protocol based on the packet type may be selected and the first packet may be translated to a second packet in accordance with the second protocol. Other embodiments are described and claimed.

公开(公告)号：AU2003268310A1

公开(公告)日：2004-03-19

申请号：AU2003268310

申请日：2003-08-29

Applicant: INTEL CORP

Inventor： GERBEHY JAY ,  LEBIZAY GERALD ,  PEEBLES BRIAN ,  GISH DAVID ,  MASSA DON

IPC: G06F13/00 ,  G06F13/40 ,  H04L12/40 ,  H05K7/14

Abstract: Multiple boards are connected within a chassis, using a multi-port Target Channel Adapter (TCA). Data is transported from a TCA on a board directly to a TCA on another board through a meshed backplane. The meshed backplane is equipped to mount boards via connectors and may consist of a fabric of copper conductors or optical fibers. Communication from TCA to TCA requires placing ports on each individual TCA along with the appropriate input and output buffering. A multi-port TCA capable of performing multiple bridging functions simultaneously i.e., bridging from a high speed serial meshed backplane to multiple local busses, i.e., Gigabit Ethernet, Fibre Channel, and TCP/IP devices, is referred to as a Fabric Interconnect Chip (FIC).

公开(公告)号：AT535077T

公开(公告)日：2011-12-15

申请号：AT04754885

申请日：2004-06-09

Applicant: INTEL CORP

Inventor： OLIVER NEAL ,  GISH DAVID ,  LEBIZAY GERALD ,  MITCHEL HENRY ,  PEEBLES BRIAN ,  STONE ALAN

IPC: H04L12/56

Abstract: A method and system for a network node for attachment to switch fabrics is described. The system includes an access unit to provide access to communications from an external network, a classification element to label received packets with information identifying an associated flow and queue, a mapping element to place the packets into one of a plurality of queues based on the label identifiers, a scheduler to schedule packets in the queues for transmission, and an encapsulation element to encapsulate the scheduled packets into uniform size frames. The uniform size frames may then be transmitted to a next destination through a switch fabric.

公开(公告)号：DE112004002504T5

公开(公告)日：2006-11-02

申请号：DE112004002504

申请日：2004-12-03

Applicant: INTEL CORP

Inventor： GISH DAVID ,  SHEIMAN ARTHUR

IPC: H04J3/16 ,  H04B1/28 ,  H04B1/40

Abstract: Described are a system and method for processing data received at or to be transmitted through a constituent base station. In one example, a digital signal may be generated based upon an RF signal received at the constituent base station. The digital signal may be encapsulated in data frames for transmission in a SONET circuit to a processing station. The processing station may recover the digital signal from received data frames and perform base-band processing on the recovered digital signal.

公开(公告)号：AU2003287649A1

公开(公告)日：2004-06-30

申请号：AU2003287649

申请日：2003-11-12

Applicant: INTEL CORP

Inventor： LEBIZAY GERALD ,  GISH DAVID ,  OLIVER NEAL

IPC: H04L29/06

Abstract: Techniques for performing protocol translation for a modular system may be described. In some examples, a first packet created in accordance with a first protocol may be received. A packet type for the first packet may be determined, a second protocol based on the packet type may be selected and the first packet may be translated to a second packet in accordance with the second protocol. Other embodiments are described and claimed.

公开(公告)号：DE60333862D1

公开(公告)日：2010-09-30

申请号：DE60333862

申请日：2003-11-12

Applicant: INTEL CORP

Inventor： LEBIZAY GERALD ,  GISH DAVID ,  OLIVER NEAL

IPC: H04L29/06

公开(公告)号：DE60313780T2

公开(公告)日：2008-01-24

申请号：DE60313780

申请日：2003-08-29

Applicant: INTEL CORP

Inventor： LEBIZAY GERALD ,  PEEBLES BRIAN ,  GISH DAVID ,  MASSA DON ,  GERBEHY JAY

IPC: G06F13/40 ,  G06F13/00 ,  H04L12/40 ,  H05K7/14

Abstract: Multiple boards are connected within a chassis, using a multi-port Target Channel Adapter (TCA). Data is transported from a TCA on a board directly to a TCA on another board through a meshed backplane. The meshed backplane is equipped to mount boards via connectors and may consist of a fabric of copper conductors or optical fibers. Communication from TCA to TCA requires placing ports on each individual TCA along with the appropriate input and output buffering. A multi-port TCA capable of performing multiple bridging functions simultaneously i.e., bridging from a high speed serial meshed backplane to multiple local busses, i.e., Gigabit Ethernet, Fibre Channel, and TCP/IP devices, is referred to as a Fabric Interconnect Chip (FIC).

公开(公告)号：DE60313780D1

公开(公告)日：2007-06-21

申请号：DE60313780

申请日：2003-08-29

Applicant: INTEL CORP

Inventor： LEBIZAY GERALD ,  PEEBLES BRIAN ,  GISH DAVID ,  MASSA DON ,  GERBEHY JAY

IPC: G06F13/40 ,  G06F13/00 ,  H04L12/40 ,  H05K7/14

Abstract: Multiple boards are connected within a chassis, using a multi-port Target Channel Adapter (TCA). Data is transported from a TCA on a board directly to a TCA on another board through a meshed backplane. The meshed backplane is equipped to mount boards via connectors and may consist of a fabric of copper conductors or optical fibers. Communication from TCA to TCA requires placing ports on each individual TCA along with the appropriate input and output buffering. A multi-port TCA capable of performing multiple bridging functions simultaneously i.e., bridging from a high speed serial meshed backplane to multiple local busses, i.e., Gigabit Ethernet, Fibre Channel, and TCP/IP devices, is referred to as a Fabric Interconnect Chip (FIC).