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公开(公告)号:AU2003268310A1
公开(公告)日:2004-03-19
申请号:AU2003268310
申请日:2003-08-29
Applicant: INTEL CORP
Inventor: GERBEHY JAY , LEBIZAY GERALD , PEEBLES BRIAN , GISH DAVID , MASSA DON
Abstract: Multiple boards are connected within a chassis, using a multi-port Target Channel Adapter (TCA). Data is transported from a TCA on a board directly to a TCA on another board through a meshed backplane. The meshed backplane is equipped to mount boards via connectors and may consist of a fabric of copper conductors or optical fibers. Communication from TCA to TCA requires placing ports on each individual TCA along with the appropriate input and output buffering. A multi-port TCA capable of performing multiple bridging functions simultaneously i.e., bridging from a high speed serial meshed backplane to multiple local busses, i.e., Gigabit Ethernet, Fibre Channel, and TCP/IP devices, is referred to as a Fabric Interconnect Chip (FIC).
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公开(公告)号:AT362137T
公开(公告)日:2007-06-15
申请号:AT03749266
申请日:2003-08-29
Applicant: INTEL CORP
Inventor: LEBIZAY GERALD , PEEBLES BRIAN , GISH DAVID , MASSA DON , GERBEHY JAY
Abstract: Multiple boards are connected within a chassis, using a multi-port Target Channel Adapter (TCA). Data is transported from a TCA on a board directly to a TCA on another board through a meshed backplane. The meshed backplane is equipped to mount boards via connectors and may consist of a fabric of copper conductors or optical fibers. Communication from TCA to TCA requires placing ports on each individual TCA along with the appropriate input and output buffering. A multi-port TCA capable of performing multiple bridging functions simultaneously i.e., bridging from a high speed serial meshed backplane to multiple local busses, i.e., Gigabit Ethernet, Fibre Channel, and TCP/IP devices, is referred to as a Fabric Interconnect Chip (FIC).
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公开(公告)号:DE60313780T2
公开(公告)日:2008-01-24
申请号:DE60313780
申请日:2003-08-29
Applicant: INTEL CORP
Inventor: LEBIZAY GERALD , PEEBLES BRIAN , GISH DAVID , MASSA DON , GERBEHY JAY
Abstract: Multiple boards are connected within a chassis, using a multi-port Target Channel Adapter (TCA). Data is transported from a TCA on a board directly to a TCA on another board through a meshed backplane. The meshed backplane is equipped to mount boards via connectors and may consist of a fabric of copper conductors or optical fibers. Communication from TCA to TCA requires placing ports on each individual TCA along with the appropriate input and output buffering. A multi-port TCA capable of performing multiple bridging functions simultaneously i.e., bridging from a high speed serial meshed backplane to multiple local busses, i.e., Gigabit Ethernet, Fibre Channel, and TCP/IP devices, is referred to as a Fabric Interconnect Chip (FIC).
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公开(公告)号:DE60313780D1
公开(公告)日:2007-06-21
申请号:DE60313780
申请日:2003-08-29
Applicant: INTEL CORP
Inventor: LEBIZAY GERALD , PEEBLES BRIAN , GISH DAVID , MASSA DON , GERBEHY JAY
Abstract: Multiple boards are connected within a chassis, using a multi-port Target Channel Adapter (TCA). Data is transported from a TCA on a board directly to a TCA on another board through a meshed backplane. The meshed backplane is equipped to mount boards via connectors and may consist of a fabric of copper conductors or optical fibers. Communication from TCA to TCA requires placing ports on each individual TCA along with the appropriate input and output buffering. A multi-port TCA capable of performing multiple bridging functions simultaneously i.e., bridging from a high speed serial meshed backplane to multiple local busses, i.e., Gigabit Ethernet, Fibre Channel, and TCP/IP devices, is referred to as a Fabric Interconnect Chip (FIC).
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