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1.发明申请RADIO- AND ELECTROMAGNETIC INTERFERENCE THROUGH-SILICON VIAS FOR STACKED-DIE PACKAGES, AND METHODS OF MAKING SAME 审中-公开用于堆叠式包装的通过硅电极的无线电和电磁干扰及其制造方法
公开(公告)号：WO2012151120A3
公开(公告)日：2013-03-28
申请号：PCT/US2012035373
申请日：2012-04-27
Applicant: INTEL CORP , KAMGAING TELESPHOR , RAO VALLURI R
Inventor： KAMGAING TELESPHOR , RAO VALLURI R
CPC classification number: H01L23/552 , H01L23/481 , H01L23/66 , H01L25/18 , H01L2223/6616 , H01L2223/6677 , H01L2224/16225 , H01L2225/06513 , H01L2225/06537 , H01L2225/06541 , H01L2924/15311
Abstract: An apparatus includes a radio-frequency die with shielding through-silicon vias and a die backside lattice lid that shield a sector in the RF die from radio - and electromagnetic interference.
Abstract translation: 一种装置包括具有屏蔽通硅通孔的射频管芯和屏蔽RF管芯中的扇区的模具背面格栅盖与无线电和电磁干扰。
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2.发明申请HIGH PERFORMANCE GLASS-BASED 60 GHZ / MM-WAVE PHASED ARRAY ANTENNAS AND METHODS OF MAKING SAME 审中-公开基于高性能玻璃的60 GHZ / MM波形相位阵列天线及其制作方法
公开(公告)号：WO2012151123A2
公开(公告)日：2012-11-08
申请号：PCT/US2012035421
申请日：2012-04-27
Applicant: INTEL CORP , KAMGAING TELESPHOR
Inventor： KAMGAING TELESPHOR
IPC: H01Q21/12
CPC classification number: H01Q1/1271 , H01L23/552 , H01L24/16 , H01L24/17 , H01L2223/6677 , H01L2224/13025 , H01L2224/14181 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/17181 , H01L2224/32155 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2225/06513 , H01L2225/06517 , H01L2225/06537 , H01L2225/06541 , H01L2225/06565 , H01L2924/10253 , H01L2924/12042 , H01L2924/1421 , H01L2924/1433 , H01L2924/14335 , H01L2924/1434 , H01Q1/2283 , H01Q3/26 , H01Q21/0087 , H01Q21/0093 , H01Q21/065 , Y10T29/49016 , H01L2924/00
Abstract: A glass-based, high-performance 60 GHz/ mm-wave antenna includes cavities disposed in a phased-array antenna (PAA) substrate. The cavities are disposed below planar antenna elements. Emitter traces are disposed on the PAA substrate opposite the planar antenna elements and the emitter traces, the cavities, and the planar antenna elements are vertically aligned.
Abstract translation: 基于玻璃的高性能60GHz / mm波天线包括设置在相控阵天线（PAA）衬底中的腔体。 空腔设置在平面天线元件下方。 发射极迹线设置在与平面天线元件相对的PAA衬底上，发射极迹线，空腔和平面天线元件垂直对齐。
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3.发明申请CHIP PACKAGES INCLUDING THROUGH-SILICON VIA DICE WITH VERTICALLY INTEGRATED PHASED-ARRAY ANTENNAS AND LOW-FREQUENCY AND POWER DELIVERY SUBSTRATES 审中-公开芯片包装，包括通过硅片与垂直集成的相位阵列天线和低频和电力输送基板
公开(公告)号：WO2012151003A3
公开(公告)日：2013-03-14
申请号：PCT/US2012029363
申请日：2012-03-16
Applicant: INTEL CORP , KAMGAING TELESPHOR , RAO VALLURI R , PALASKAS YORGOS
Inventor： KAMGAING TELESPHOR , RAO VALLURI R , PALASKAS YORGOS
IPC: H01L23/48
CPC classification number: H01Q3/30 , H01L23/66 , H01L25/0657 , H01L25/16 , H01L25/18 , H01L2223/6677 , H01L2224/13025 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2225/06513 , H01L2225/06517 , H01L2924/15321 , H01Q1/2283 , H01Q9/0414 , H01Q21/065 , H01Q23/00 , Y10T29/49004 , Y10T29/49018
Abstract: An apparatus includes a die with through-silicon vias and radio frequency integrated circuit capabilities and it is vertically integrated with a phased-array antenna substrate. The through-silicon via and a radio frequency integrated circuit is coupled to a plurality of antenna elements disposed on the phased-array antenna substrate where each of the plurality of antenna elements is coupled to the through-silicon vias and radio frequency integrated circuit through a plurality of through-silicon vias. A process of assembling the through-silicon vias and radio frequency integrated circuit to the phased-array antenna substrate includes testing the apparatus.
Abstract translation: 一种装置包括具有通硅通孔和射频集成电路功能的裸片，并且与相控阵天线基板垂直集成。 穿硅通孔和射频集成电路耦合到布置在相控阵天线基板上的多个天线元件，其中多个天线元件中的每一个天线元件通过一个通孔硅通孔和射频集成电路 多个通硅通孔。 将穿硅通孔和射频集成电路组装到相控阵天线基板的过程包括测试该装置。
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4.发明申请HIGH PERFORMANCE GLASS-BASED 60 GHZ / MM-WAVE PHASED ARRAY ANTENNAS AND METHODS OF MAKING SAME 审中-公开基于高性能玻璃的60 GHZ / MM波形相位阵列天线及其制作方法
公开(公告)号：WO2012151123A3
公开(公告)日：2013-01-10
申请号：PCT/US2012035421
申请日：2012-04-27
Applicant: INTEL CORP , KAMGAING TELESPHOR
Inventor： KAMGAING TELESPHOR
IPC: H01Q21/12
CPC classification number: H01Q1/1271 , H01L23/552 , H01L24/16 , H01L24/17 , H01L2223/6677 , H01L2224/13025 , H01L2224/14181 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/17181 , H01L2224/32155 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2225/06513 , H01L2225/06517 , H01L2225/06537 , H01L2225/06541 , H01L2225/06565 , H01L2924/10253 , H01L2924/12042 , H01L2924/1421 , H01L2924/1433 , H01L2924/14335 , H01L2924/1434 , H01Q1/2283 , H01Q3/26 , H01Q21/0087 , H01Q21/0093 , H01Q21/065 , Y10T29/49016 , H01L2924/00
Abstract: A glass-based, high-performance 60 GHz/ mm-wave antenna includes cavities disposed in a phased-array antenna (PAA) substrate. The cavities are disposed below planar antenna elements. Emitter traces are disposed on the PAA substrate opposite the planar antenna elements and the emitter traces, the cavities, and the planar antenna elements are vertically aligned.
Abstract translation: 基于玻璃的高性能60GHz / mm波天线包括设置在相控阵天线（PAA）衬底中的腔体。 空腔设置在平面天线元件下方。 发射极迹线设置在与平面天线元件相对的PAA衬底上，发射极迹线，空腔和平面天线元件垂直对齐。
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5.发明公开DIE PACKAGE WITH SUPERPOSER SUBSTRATE FOR PASSIVE COMPONENTS 审中-公开CHIPVERPACKUNG MITÜBERGELAGERTEMSUBSTRATFÜR被动宝宝
公开(公告)号：EP3050098A4
公开(公告)日：2017-05-10
申请号：EP13894760
申请日：2013-09-27
Applicant: INTEL CORP
Inventor： KAMGAING TELESPHOR , RAO VALLURI R
IPC: H01L23/48 , H01L23/498 , H01L23/538 , H01L23/66 , H01L25/00 , H01L25/065 , H01L25/16
CPC classification number: H01L23/66 , H01L23/481 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/5389 , H01L25/0657 , H01L25/16 , H01L25/50 , H01L2223/6616 , H01L2223/6655 , H01L2223/6672 , H01L2224/16225 , H01L2224/16265 , H01L2225/06517 , H01L2225/0652 , H01L2225/06544 , H01L2225/06555 , H01L2225/06572 , H01L2225/06582
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Patent Agency Ranking
公开(公告)号：EP2656385A4
公开(公告)日：2017-12-13
申请号：EP10861039
申请日：2010-12-20
Applicant: INTEL CORP
Inventor： KAMGAING TELESPHOR , RAO VALLURI
IPC: H01L27/02 , H01L23/522 , H01L23/66 , H01L25/18 , H04B1/44
CPC classification number: H04B1/08 , H01F17/0013 , H01F2017/002 , H01F2017/0086 , H01L23/49822 , H01L23/5223 , H01L23/5227 , H01L23/645 , H01L24/16 , H01L24/48 , H01L25/16 , H01L28/10 , H01L2224/16227 , H01L2224/48227 , H01L2924/09701 , H01L2924/1421 , H01L2924/14335 , H01L2924/19011 , H01L2924/19105 , H01L2924/30107
Abstract: Functionality of front-end module radio frequency (RF) devices is divided between a hybrid system on chip (SoC) that includes a digital processor and an RF integrated circuit device (DP-RFIC device), and a package substrate for the hybrid device. Methods of assembling include forming inductors and transformers integral to the package substrate and mounting the DP-RFIC device in proximity to the inductors and transformers.
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7.发明公开RADIO- AND ELECTROMAGNETIC INTERFERENCE THROUGH-SILICON VIAS FOR STACKED-DIE PACKAGES, AND METHODS OF MAKING SAME 审中-公开无线电和电磁干扰硅经文用于生产堆叠芯片封装和工艺
公开(公告)号：EP2705532A4
公开(公告)日：2015-03-11
申请号：EP12779644
申请日：2012-04-27
Applicant: INTEL CORP
Inventor： KAMGAING TELESPHOR , RAO VALLURI R
IPC: H01L23/66 , H01L23/48 , H01L23/552 , H01L25/18 , H05K9/00
CPC classification number: H01L23/552 , H01L23/481 , H01L23/66 , H01L25/18 , H01L2223/6616 , H01L2223/6677 , H01L2224/16225 , H01L2225/06513 , H01L2225/06537 , H01L2225/06541 , H01L2924/15311
Abstract: An apparatus includes a radio-frequency die with shielding through-silicon vias and a die backside lattice lid that shield a sector in the RF die from radio- and electromagnetic interference.
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公开(公告)号：EP2044626A4
公开(公告)日：2012-03-14
申请号：EP07799114
申请日：2007-06-27
Applicant: INTEL CORP
Inventor： KAMGAING TELESPHOR
IPC: H01L23/538 , H01L21/764 , H01L21/768 , H01L21/8234 , H01L21/8238 , H01L23/48 , H01L23/58
CPC classification number: H01L21/823878 , H01L21/76224 , H01L21/764 , H01L21/76898 , H01L21/823481 , H01L23/481 , H01L23/585 , H01L2924/0002 , H01L2924/00
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公开(公告)号：EP3140859A4
公开(公告)日：2018-01-24
申请号：EP14891343
申请日：2014-05-06
Applicant: INTEL CORP
Inventor： KAMGAING TELESPHOR , ELSHERBINI ADEL A , FRANK TORREY W
CPC classification number: H01L23/49838 , G06F1/1613 , G06Q30/02 , H01L21/288 , H01L21/4857 , H01L21/486 , H01L23/145 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L23/5223 , H01L23/562 , H01L23/66 , H01L2223/6672 , H01L2223/6677 , H01L2224/16227 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2924/10253 , H01L2924/1421 , H01L2924/1433 , H01L2924/1434 , H01L2924/15311 , H01L2924/15321 , H01L2924/3511
Abstract: Embodiments of the present disclosure describe a multi-layer package with antenna and associated techniques and configurations. In one embodiment, an integrated circuit (IC) package assembly includes a first layer having a first side and a second side disposed opposite to the first side a second layer coupled with the first side of the first layer, one or more antenna elements coupled with the second layer and a third layer coupled with the second side of the first layer, wherein the first layer is a reinforcement layer having a tensile modulus that is greater than a tensile modulus of the second layer and the third layer. Other embodiments may be described and/or claimed.
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10.发明公开HIGH PERFORMANCE GLASS-BASED 60 GHZ / MM-WAVE PHASED ARRAY ANTENNAS AND METHODS OF MAKING SAME 审中-公开对高性能基于玻璃的60GHz /毫米波相控用于生产与天线和过程
公开(公告)号：EP2705572A4
公开(公告)日：2014-11-26
申请号：EP12779473
申请日：2012-04-27
Applicant: INTEL CORP
Inventor： KAMGAING TELESPHOR
CPC classification number: H01Q1/1271 , H01L23/552 , H01L24/16 , H01L24/17 , H01L2223/6677 , H01L2224/13025 , H01L2224/14181 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/17181 , H01L2224/32155 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2225/06513 , H01L2225/06517 , H01L2225/06537 , H01L2225/06541 , H01L2225/06565 , H01L2924/10253 , H01L2924/12042 , H01L2924/1421 , H01L2924/1433 , H01L2924/14335 , H01L2924/1434 , H01Q1/2283 , H01Q3/26 , H01Q21/0087 , H01Q21/0093 , H01Q21/065 , Y10T29/49016 , H01L2924/00
Abstract: A glass-based, high-performance 60 GHz/mm-wave antenna includes cavities disposed in a phased-array antenna (PAA) substrate. The cavities are disposed below planar antenna elements. Emitter traces are disposed on the PAA substrate opposite the planar antenna elements and the emitter traces, the cavities, and the planar antenna elements are vertically aligned.
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