公开(公告)号：MY138557A

公开(公告)日：2009-06-30

申请号：MYPI20044164

申请日：2004-10-11

Applicant: INTEL CORP

Inventor： KIM SARAH E ,  LIST R SCOTT ,  MAVEETY JAMES G ,  MYERS ALAN M ,  VU QUAT T

IPC: F04B17/00 ,  F04B19/00 ,  H01L23/473 ,  H01L25/065

Abstract: A STACK OF HEAT GENERATING INTEGRATED CIRCUIT CHIPS MAY BE PROVIDED WITH INTERVENING COOLING INTEGRATED CIRCUIT CHIPS. THE COOLING INTEGRATED CIRCUIT CHIPS MAY INCLUDE MICROCHANNELS FOR THE FLOW OF THE COOLING FLUID. THE COOLING FLUID MAY BE PUMPED USING THE INTEGRATED ELECTROSMOTIC PUMPS. REMOVAL OF COOLING FLUID GASES MAY BE ACCOMPLISHED USING INTEGRATED RE-COMBINERS IN SOME EMBODIMENTS.

公开(公告)号：MY138510A

公开(公告)日：2009-06-30

申请号：MYPI20044480

申请日：2004-10-29

Applicant: INTEL CORP

Inventor： KIM SARAH E ,  LIST R SCOTT ,  MAVEETY JAMES G ,  MYERS ALAN M ,  VU QUAT T ,  PRASHER RAVI ,  MAHAJAN RAVI ,  VANDENTOP GILROY

IPC: H01L23/473

Abstract: AN INTEGRATED CIRCUIT TO BE COOLED MAY BE ABUTTED IN FACE-TO-FACE ABUTMENT WITH A COOLING INTEGRATED CIRCUIT. THE COOLING INTEGRATED CIRCUIT MAY INCLUDE ELECTROOSMOTIC PUMPS (28) TO PUMP COOLING FLUID THROUGH THE COOLING INTEGRATED CIRCUITS VIA MICROCHANNELS (68A,68B) TO THEREBY COOL THE HEAT GENERATING INTEGRATED CIRCUIT. THE ELECTROOSMOTIC PUMPS (28) MAY BE FLUIDIC ALLY COUPLED TO EXTERNAL RADIATORS (132) WHICH EXTEND UPWARDLY AWAY FROM A PACKAGE (129) INCLUDING THE INTEGRATED CIRCUITS. IN PARTICULAR, THE EXTERNAL RADIATORS (132) MAY BE MOUNTED ON TUBES WHICH EXTEND THE RADIATORS AWAY FROM THE PACKAGE (129).FIG. 1