公开(公告)号：AU4981496A

公开(公告)日：1996-10-16

申请号：AU4981496

申请日：1996-02-15

Applicant: INTEL CORP

Inventor： KUHN HARRY A ,  MALLIK DEBENDRA ,  SETH ASHOK

IPC: G06K19/073 ,  H01L23/58 ,  H01L25/18 ,  H05K1/14

Abstract: An integrated circuit package which has a flexible circuit that covers an integrated circuit. The flexible circuit contains a conductive line which prevents a probe from accessing the integrated circuit. The conductive line of the flexible circuit can be attached to the power lines, synchronization line, memory erase line, or any other line that will disable, erase or otherwise prevent access to the integrated circuit if the flexible circuit conductive line is broken. The integrated circuit can be mounted to a printed circuit board. The printed circuit board, integrated circuit and flexible circuit can all be enclosed within the package.

公开(公告)号：AU5189596A

公开(公告)日：1996-10-02

申请号：AU5189596

申请日：1996-03-12

Applicant: INTEL CORP

Inventor： KUHN HARRY A

IPC: H01L25/18 ,  H01L23/31 ,  H01L23/495 ,  H01L25/065 ,  H01L25/07 ,  H01R9/09 ,  H01R43/02 ,  H01L21/60 ,  H01L23/14 ,  B23K31/02 ,  H05K5/02

Abstract: A package housing multiple semiconductor die includes a leadframe having a paddle and a number of lead fingers. A flexible circuit is adhesively laminated to both sides of the paddle. A first semiconductor die is back-mounted to the bottom surface of the paddle and wire-bonded to the flexible circuit and the lead fingers. A second semiconductor die is back-mounted to the top surface of the paddle and to the flexible circuit. The dies are encapsulated in a security coating and encased in plastic.

公开(公告)号：EP0815615A4

公开(公告)日：2000-12-06

申请号：EP96908756

申请日：1996-03-12

Applicant: INTEL CORP

Inventor： KUHN HARRY A

IPC: H01L25/18 ,  H01L23/31 ,  H01L23/495 ,  H01L25/065 ,  H01L25/07 ,  H01R9/09 ,  B23K31/02 ,  H01L21/60 ,  H01L23/14 ,  H01R43/02 ,  H05K5/02

CPC classification number: H01L24/49 ,  H01L23/3107 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49112 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19107 ,  H01L2224/05599

Abstract: A package (50) housing multiple semiconductor dies (22, 23) includes a leadframe having a paddle (20) and a number of lead fingers (21). A flexible circuit (27) is adhesively laminated to both sides of the paddle. A first semiconductor die (23) is back-mounted to the bottom surface of the paddle and wire-bonded to the flexible circuit and the lead fingers. A second semiconductor die (22) is back-mounted to the top surface of the paddle and to the flexible circuit. The dies (22, 23) are encapsulated in a security coating (40) and encased in plastic (50).

Abstract translation: 容纳多个半导体管芯的封装包括具有焊盘和多个引线指的引线框架。 柔性电路粘合地层压在桨的两侧。 第一半导体管芯被背面安装到焊盘的底表面上并引线接合到柔性电路和引线指。 第二半导体管芯被背面安装到桨的顶表面和柔性回路。 模具被封装在安全涂层中并且封装在塑料中。

公开(公告)号：EP0818132A4

公开(公告)日：2000-01-05

申请号：EP96906435

申请日：1996-02-15

Applicant: INTEL CORP

Inventor： KUHN HARRY A ,  MALLIK DEBENDRA ,  SETH ASHOK

IPC: G06K19/073 ,  H01L23/58 ,  H01L25/18 ,  H05K1/14

CPC classification number: H01L23/576 ,  G06K19/07372 ,  H01L25/18 ,  H01L2924/0002 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49171 ,  H01L2924/00

Abstract: An integrated circuit package which has a flexible circuit (12) that covers an integrated circuit (14). The flexible circuit (12) contains a conductive line (18) which prevents a probe (16) from accessing the integrated circuit (14). The conductive line (18) of the flexible circuit can be attached to the power lines, synchronization line, memory erase line, or any other line that will disable, erase or otherwise prevent access to the integrated circuit (14) if the flexible circuit conductive line is broken. The integrated circuit (14) can be mounted to a printed circuit board (15). The printed circuit board, integrated circuit and flexible circuit can all be enclosed within a package.