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    4.
    发明专利
    未知

    公开(公告)号：DE602004008615D1

    公开(公告)日：2007-10-11

    申请号：DE602004008615

    申请日：2004-04-14

    Applicant: INTEL CORP

    Inventor： DISTEFANO ERIC ,  POKHARNA HIMANSHU

    IPC: H05K7/20 ,  G06F1/20 ,  H05K1/02

    Abstract: An apparatus including an actuation membrane unit to generate air movement in a direction of a heat generating device to reduce an ambient temperature of the device.

    5.
    发明专利
    未知

    公开(公告)号：AT439628T

    公开(公告)日：2009-08-15

    申请号：AT04785269

    申请日：2004-09-29

    Applicant: INTEL CORP

    Inventor： POKHARNA HIMANSHU

    IPC: G06F1/20 ,  F25B9/00 ,  F25B25/00 ,  F25B27/00 ,  G06F1/32

    Abstract: A reversible cooling loop for a notebook computer is described. Specifically, at low power levels, a two-phase fluid cooling loop is implemented to conserve the battery life. At high power levels, a refrigeration loop is implemented.

    6.
    发明专利
    未知

    公开(公告)号：DE602004008615T2

    公开(公告)日：2007-12-27

    申请号：DE602004008615

    申请日：2004-04-14

    Applicant: INTEL CORP

    Inventor： DISTEFANO ERIC ,  POKHARNA HIMANSHU

    IPC: H05K7/20 ,  G06F1/20 ,  H05K1/02

    Abstract: An apparatus including an actuation membrane unit to generate air movement in a direction of a heat generating device to reduce an ambient temperature of the device.

    IC COOLANT MICROCHANNEL ASSEMBLY WITH INTEGRATED ATTACHMENT HARDWARE
    7.
    发明申请
    IC COOLANT MICROCHANNEL ASSEMBLY WITH INTEGRATED ATTACHMENT HARDWARE 审中-公开
    带集成附件硬件的IC COOLANT MICROCHANNEL组件

    公开(公告)号：WO2008008085A3

    公开(公告)日：2008-04-17

    申请号：PCT/US2006038330

    申请日：2006-10-02

    Applicant: INTEL CORP ,  MONGIA RAJIV ,  POKHARNA HIMANSHU ,  DISTEFANO ERIC ,  MCEUEN SHAWN ,  WILK BRIAN

    Inventor： MONGIA RAJIV ,  POKHARNA HIMANSHU ,  DISTEFANO ERIC ,  MCEUEN SHAWN ,  WILK BRIAN

    IPC: H01L23/473

    CPC classification number: H01L23/473 ,  F28F3/12 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An apparatus includes a micro channel structure that has micro channels formed therein. The micro channels are for transporting a coolant and are intended to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus further includes a cover positioned on the micro channel structure. The cover has formed therein a right-angle passage to provide fluid communication between a first port on a lower horizontal surface of the cover and a second port on a vertical surface of the cover. The cover includes a plurality of tabs. Each tab extends from a respective corner of the cover. The tabs each have an aperture formed therein. The apertures are shaped and sized to receive a fastener.

    Abstract translation: 一种装置包括具有形成在其中的微通道的微通道结构。 微通道用于输送冷却剂并且旨在接近集成电路以将热量从集成电路传递到冷却剂。 该设备还包括位于微通道结构上的盖子。 盖在其中形成直角通道以提供盖的下水平表面上的第一端口与盖的垂直表面上的第二端口之间的流体连通。 盖子包括多个凸片。 每个标签从盖子的相应角落延伸。 每个翼片都具有形成在其中的孔。 这些孔的形状和大小适合接收紧固件。

    METHOD, APPARATUS AND SYSTEM FOR CARBON NANOTUBE WICK STRUCTURES
    9.
    发明申请
    METHOD, APPARATUS AND SYSTEM FOR CARBON NANOTUBE WICK STRUCTURES 审中-公开
    碳纳米管芯结构的方法，装置和系统

    公开(公告)号：WO2008079430A9

    公开(公告)日：2008-08-14

    申请号：PCT/US2007069863

    申请日：2007-05-29

    Applicant: INTEL CORP ,  VADAKKANMARUVEEDU UNNIKRISHINA ,  CHRYSLER GREGORY ,  PRASHER RAVI ,  POKHARNA HIMANSHU

    Inventor： VADAKKANMARUVEEDU UNNIKRISHINA ,  CHRYSLER GREGORY ,  PRASHER RAVI ,  POKHARNA HIMANSHU

    CPC classification number: H01L23/427 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/046 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method, apparatus and system are described for carbon nanotube wick structures. The system may include a frame and an apparatus. The apparatus may include a heat exchanger, a cold plate with a cold plate internal volume, and a heat pipe in the cold plate internal volume. In some embodiments, the heat pipe includes a thermally conductive wall material forming the inner dimensions of the heat pipe, a catalyst layer deposited onto the wall material, a carbon nanotube array formed on the catalyst layer, and a volume of working fluid. Other embodiments may be described.

    Abstract translation: 描述了用于碳纳米管芯结构的方法，装置和系统。 该系统可以包括框架和装置。 该设备可以包括热交换器，具有冷板内部容积的冷却板以及冷却板内部容积中的热管。 在一些实施例中，热管包括形成热管的内部尺寸的导热壁材料，沉积到壁材料上的催化剂层，形成在催化剂层上的碳纳米管阵列和一定体积的工作流体。 其他实施例可以被描述。

    SYSTEMS FOR IMPROVED BLOWER FANS
    10.
    发明申请
    SYSTEMS FOR IMPROVED BLOWER FANS 审中-公开
    改进的鼓风机系统

    公开(公告)号：WO2006074447A3

    公开(公告)日：2006-11-09

    申请号：PCT/US2006000751

    申请日：2006-01-05

    Applicant: INTEL CORP ,  NISHI YOSHIFUMI ,  KURODA MASAHIRO ,  MACHIROUTU SRIDHAR ,  POKHARNA HIMANSHU ,  STAFFORD KAREN

    Inventor： NISHI YOSHIFUMI ,  KURODA MASAHIRO ,  MACHIROUTU SRIDHAR ,  POKHARNA HIMANSHU ,  STAFFORD KAREN

    IPC: G06F1/20 ,  F04D29/42 ,  H05K7/20

    CPC classification number: G06F1/203 ,  F04D29/162 ,  F04D29/4213 ,  F04D29/4226

    Abstract: According to some embodiments, systems for improved blower fans are provided. In some embodiments, systems may include a casing (210) comprising an inlet (212,214) to accept a fluid and an outlet (216) to evacuate the fluid. The systems may further comprise an impeller disposed within the casing, comprising a hub (220) and one or more impeller blades (222) coupled to the hub. In some embodiments, the inlet of the casing may be shaped (218) to reduce the amount of fluid that evacuates the casing via the inlet due to pressure within the casing.

    Abstract translation: 根据一些实施例，提供了用于改进的鼓风机的系统。 在一些实施例中，系统可以包括壳体（210），其包括用于接收流体的入口（212,214）和排出流体的出口（216）。 该系统还可以包括设置在壳体内的叶轮，包括轮毂（220）和联接到轮毂的一个或多个叶轮叶片（222）。 在一些实施例中，壳体的入口可以是成形的（218），以减少由于壳体内的压力而通过入口抽出壳体的流体的量。

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