公开(公告)号：WO0247451A2

公开(公告)日：2002-06-13

申请号：PCT/US0144163

申请日：2001-11-06

Applicant: INTEL CORP ,  SEARLS DAMION T ,  DISHONGH TERRACE J ,  DUJARI PRATEEK ,  LIAN BIN

Inventor： SEARLS DAMION T ,  DISHONGH TERRACE J ,  DUJARI PRATEEK ,  LIAN BIN

IPC: H01L23/467 ,  H05K7/00

CPC classification number: H01L23/467 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: A heat dissipation device that includes a conduit in a base portion thereof. An opening extends from a dissipation surface of the base portion to a conduit. The conduit allows air from a fan to flow within the base portion, which can improve heat removal from hotspots, and alleviate air stagnation in the heat dissipation device.

Abstract translation: 一种散热装置，其包括在其基部的导管。 开口从基部的耗散表面延伸到导管。 导管允许来自风扇的空气在基部内流动，这可以改善从热点排出的热量，并减轻散热装置中的空气滞留。

公开(公告)号：WO0169677A3

公开(公告)日：2002-02-14

申请号：PCT/US0104565

申请日：2001-02-13

Applicant: INTEL CORP ,  SEARLS DAMION T ,  DISHONGH TERRANCE J ,  PULLEN DAVID H

Inventor： SEARLS DAMION T ,  DISHONGH TERRANCE J ,  PULLEN DAVID H

IPC: H01L23/427

CPC classification number: F28D15/00 ,  C09K5/063 ,  F28D20/021 ,  F28D2021/0031 ,  F28F23/00 ,  G06F1/20 ,  H01L23/4275 ,  H01L2924/0002 ,  Y02E60/145 ,  Y10T29/49353 ,  H01L2924/00

Abstract: A heat sink includes a heat sink body including a number of fins and a cavity for holding a phase change material and a number of particles to enhance the mixing of the phase change material during the operation of the heat sink. In operation, the body of the heat sink conducts thermal energy to the phase change material. The energy is absorbed during the phase change of the phase change material. After absorbing energy and changing to a liquid state, the phase change material continues to dissipate energy by convection. The convention currents in the cavity are directed by the shape of the cavity surfaces an enhanced by the particles intermixed with the phase change material.

Abstract translation: 散热器包括散热体，散热体包括多个翅片和用于保持相变材料的空腔和多个颗粒，以在散热器的操作期间增强相变材料的混合。 在操作中，散热器的主体对相变材料传导热能。 能量在相变材料的相变期间被吸收。 在吸收能量并变为液体状态之后，相变材料通过对流继续耗散能量。 空腔中的常规电流由空腔表面的形状引导，由与相变材料混合的颗粒增强。

公开(公告)号：MY127104A

公开(公告)日：2006-11-30

申请号：MYPI20011796

申请日：2001-04-14

Applicant: INTEL CORP

Inventor： DISHONGH TERRANCE J ,  SEARLS DAMION T ,  DUJARI PRATEEK ,  LIAN BIN

IPC: G01K1/14 ,  H05K1/02 ,  H01L41/08 ,  H05K1/18

Abstract: PIEZOELECTRIC MATERIAL IS EMBEDDED IN EPOXY LAYERS (220) OF CIRCUIT CARDS (102) TO CONTROL THERMAL EXPANSION AND CONTRACTION AS A FUNCTION OF TEMPERATURE CHANGES. A TEMPERATURE SENSOR (212) AND THERMOSTAT (214) GENERATES A CONTROLLED VOLTAGE AS A FUNCTION OF TEMPERATURE AND APPLIES THE VOLTAGE TO PIEZOELECTRIC BLOCKS (120) WITHIN THE CIRCUIT CARD (102). LOCAL AREAS OF THE CIRCUIT CARD CAN HAVE DIFFERENT AMOUNTS OF PIEZOELECTRIC MATERIAL OR DIFFERENT THERMOSTAT. PIEZOELECTRIC BLOCKS (120) CAN BE ARRANGED IN REGULAR PATTERNS OR CAN BE RANDOMLY OR PSEUDO-RANDOMLY PLACED.(FIG 2)

公开(公告)号：HK1050761A1

公开(公告)日：2003-07-04

申请号：HK03100289

申请日：2003-01-13

Applicant: INTEL CORP

Inventor： SEARLS DAMION T ,  DISHONGH TERRANCE J ,  PULLEN DAVID H

IPC: H01L20060101 ,  F28D20060101 ,  F28F20060101 ,  G06F20060101 ,  H01L23/427

Abstract: In one embodiment, an apparatus includes a phase change material, a plurality of particles intermixed with the phase change material, and a conductive structure encapsulating the phase change material. The conductive structure includes a cavity including a cone shape. In one embodiment, a method includes forming a conductive structure having a cavity, injecting a phase change material into the cavity, injecting a plurality of spheres into the cavity, and sealing the cavity.

公开(公告)号：MY135650A

公开(公告)日：2008-06-30

申请号：MYPI20031688

申请日：2003-05-05

Applicant: INTEL CORP

Inventor： SEARLS DAMION T ,  ROTH WESTON C ,  DANIEL JACKSON JAMES

IPC: H01L21/60 ,  H01L23/64 ,  H05K1/02 ,  H05K1/14

Abstract: A SYSTEM TO PACKAGE HIGH PERFORMANCE MICROELECTRONIC DEVICES, SUCH AS PROCESSORS, RESPONDS TO COMPONENT TRANSIENTS. IN ONE EMBODIMENT, THE SYSTEM INCLUDES A DECOUPLING CAPACITOR [130] THAT IS DISPOSED BETWEEN A VCC ELECTRICAL BUMP AND A VCC ELECTRICAL BUMP. THE DECOUPLING CAPACITOR[130] HAD VCC AND VSS TERMINALS[134]. THE VCC AND VSS TERMINALS[134] SHARE ELECTRICAL PADS WITH THE VCC ELECTRICAL BUMP AND THE VSS ELECTRICAL BUMP. A SIMPLE CURRENT LOOP IS CREATED THAT IMPROVES THE POWER DELIVERY FOR THE SYSTEM.FIG.1

公开(公告)号：AU3819001A

公开(公告)日：2001-09-24

申请号：AU3819001

申请日：2001-02-13

Applicant: INTEL CORP ,  SEARLS DAMION T ,  DISHOHGH TERRANCE J ,  PULLEN DAVID H

Inventor： SEARLS DAMION T ,  DISHONGH TERRANCE J ,  PULLEN DAVID H

IPC: H01L23/427

Abstract: In one embodiment, an apparatus includes a phase change material, a plurality of particles intermixed with the phase change material, and a conductive structure encapsulating the phase change material. The conductive structure includes a cavity including a cone shape. In one embodiment, a method includes forming a conductive structure having a cavity, injecting a phase change material into the cavity, injecting a plurality of spheres into the cavity, and sealing the cavity.

公开(公告)号：DE60130549T2

公开(公告)日：2008-06-19

申请号：DE60130549

申请日：2001-04-03

Applicant: INTEL CORP

Inventor： DISHONGH TERRANCE J ,  SEARLS DAMION T ,  LIAN BIN ,  DUJARI PRATEEK

IPC: H05K1/18 ,  G01K1/14 ,  H05K1/02

Abstract: Piezoelectric material is embedded in epoxy layers of circuit cards to control thermal expansion and contraction as a function of temperature changes. A temperature sensor and thermostat generates a controlled voltage as a function of temperature and applies the voltage to piezoelectric blocks within the circuit card. Local areas of the circuit card can have different amounts of piezoelectric material or different thermostats. Piezoelectric blocks can be arranged in regular patterns or can be randomly or pseudo-randomly placed.

公开(公告)号：MY134315A

公开(公告)日：2007-12-31

申请号：MYPI20032442

申请日：2003-06-28

Applicant: INTEL CORP

Inventor： SEARLS DAMION T ,  DISHONGH TERRANCE J ,  DANIEL JACKSON JAMES

IPC: H01L23/10 ,  F28F7/00 ,  H01L23/26 ,  H01L23/34 ,  H01L23/433 ,  H05K7/20

Abstract: AN EMBODIMENT OF THE PRESENT INVENTION DESCRIBED AND SHOWN IN THE SPECIFICATION AND DRAWINGS IS A PROCESS AND A PACKAGE FOR FACILITATING COOLING AND GROUNDING OF A SEMICONDUCTOR DIE [12] USING CARBON NANOTUBES [38] IN A THERMAL INTERFACE LAYER [26] BETWEEN THE DIE [12] AND A THERMAL MANAGEMENT AID. THE EMBODIMENTS THAT ARE DISCLOSED HAVE THE CARBON NANOTUBES [38] POSITIONED AND SIZED TO UTILIZE THEIR HIGH THERMAL AND ELECTRICAL CONDUCTANCE TO FACILITATE THE FLOW OF HEAT AND CURRENT TO THE THERMAL MANAGEMENT AID. ONE EMBODIMENT DISCLOSED HAS THE CARBON NANOTUBES [38] MIXED WITH A PASTE MATRIX BEFORE BEING APPLIED. ANOTHER DISCLOSED EMBODIMENT HAS THE CARBON NANOTUBES [38] GROWN ON THE SURFACE [16] OF THE SEMICONDUCTOR DIE [12].(FIG 3)

公开(公告)号：MY122997A

公开(公告)日：2006-05-31

申请号：MYPI20011745

申请日：2001-04-12

Applicant: INTEL CORP

Inventor： DISHONGH TERRANCE J ,  SEARLS DAMION T ,  DUJARI PRATEEK ,  LIAN BIN

IPC: F16F15/02 ,  F16F15/00 ,  G05D19/02 ,  H05K1/02 ,  H05K1/18

Abstract: PIEZOELECTRIC WAFERS (104, 106) ARE AFFIXED TO A CIRCUIT CARD (102) TO CONTROL DISPLACEMENT OF THE CIRCUIT CARD WHEN VIBRATED . A TRIGGER WAFER (110) LOCATED AT AN ANTI-NODE OF THE DOMINANT MODE SHAPE PRODUCES A VOLTAGE AS A FUNCTION OF MODAL DISPLACEMENT . A CONTROL SYSTEM (114) RESPONSIVE TO THE TRIGGER WAFER (110) PRODUCES VOLTAGES THAT ARE APPLIED TO FLEX WAFERS (104, 106) AT A DIFFERENT ANTI-NODE OF THE DOMINANT MODE SHAPE. THE FLEX WAFERS EXPAND AND CONTRACT IN A MANNER THAT REDUCES THE MODAL DISPLACEMENT OF THE CIRCUIT CARD (102). MULTIPLE FLEX WAFERS CAN EXIST, AFFIXED TO THE CIRCUIT CARD SUBSTANTIALLY OPPOSITE EACH OTHER , OR A SINGLE FLEX WAFER CAN EXIST WITH A SINGLE TRIGGER WAFER (110). THE TRIGGER WAFER (110) CAN BE LOCATED SUBSTANTIALLY OPPOSITE THE FLEX WAFER OR CAN BE LOCATED ELSEWHERE ON THE CIRCUIT CARD (102). FIGURE 1A.

公开(公告)号：MY134766A

公开(公告)日：2007-12-31

申请号：MYPI20010813

申请日：2001-02-23

Applicant: INTEL CORP

Inventor： JACKSON JAMES D ,  DISHONGH TERRANCE J ,  SEARLS DAMION T

IPC: G02F1/09 ,  G09F9/37

Abstract: A DISPLAY (105) INCLUDES PIXELS (207) HAVING A MAGNETICALLY CONTROLLABLE REFLECTIVITY.THE PIXELS (207) ARE FORMED BETWEEN A PAIR OF FLEXIBLE NON-CONDUCTIVE SHEETS (201). EACH OF THE MAGNETICALLY CONTROLLABLE PIXELS INCLUDES A FLEXIBLE RING (215) LOCATED BETWEEN THE FLEXIBLE NONCONDUCTIVE SHEETS (201). EACH OF THE MAGNETICALLY CONTROLLABLE PIXELS ALSO INCLUDES MAGNETIC PARTICLES (219) LOCATED WITHIN THE FLEXIBLE RING (215). THE LOCATION OF THE MAGNETIC PARTICLES (219) WITH RESPECT TO THE FLEXIBLE NON-CONDUCTIVE SHEETS (201) DETERMINES THE REFLECTIVITY OF THE PIXEL. THE DISPLAY (105) IS ESPECIALLY SUITABLE FOR USE IN CONNECTION WITH PORTABLE ELECTRONIC DEVICES(FIG 3A,3B).