公开(公告)号：WO0235655A3

公开(公告)日：2002-08-29

申请号：PCT/US0131815

申请日：2001-10-12

Applicant: INTEL CORP ,  SEARLS DAMION ,  DISHONGH TERRANCE ,  DUJARI PRATEEK ,  LIAN BIN

Inventor： SEARLS DAMION ,  DISHONGH TERRANCE ,  DUJARI PRATEEK ,  LIAN BIN

IPC: H01R12/57 ,  H01R12/70 ,  H05K3/34 ,  H01R12/36 ,  H01R4/02

CPC classification number: H01R12/57 ,  H01R12/7011 ,  H01R12/707 ,  H05K3/3426 ,  Y02P70/613

Abstract: An enhanced joint thickness lead used for surface mounting electronic devices to a substrate, wherein a portion of the enhanced joint thickness lead that is substantially parallel to the substance. The enhanced joint thickness lead includes an arcuate structure, which provides an enhanced joint thickness for the solder used to connect the lead to the substrate. The enhanced joint thickness of the solder results in a more robust attachment of the electronic device.

Abstract translation: 用于将电子器件表面安装到基底的增强的接合厚度引线，其中增强的接合厚度引线的一部分基本上平行于物质。 增强的接头厚度引线包括弓形结构，其为用于将引线连接到衬底的焊料提供增强的接合厚度。 焊料的增强的接合厚度导致电子器件的更牢固的附着。

公开(公告)号：WO0247451A2

公开(公告)日：2002-06-13

申请号：PCT/US0144163

申请日：2001-11-06

Applicant: INTEL CORP ,  SEARLS DAMION T ,  DISHONGH TERRACE J ,  DUJARI PRATEEK ,  LIAN BIN

Inventor： SEARLS DAMION T ,  DISHONGH TERRACE J ,  DUJARI PRATEEK ,  LIAN BIN

IPC: H01L23/467 ,  H05K7/00

CPC classification number: H01L23/467 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: A heat dissipation device that includes a conduit in a base portion thereof. An opening extends from a dissipation surface of the base portion to a conduit. The conduit allows air from a fan to flow within the base portion, which can improve heat removal from hotspots, and alleviate air stagnation in the heat dissipation device.

Abstract translation: 一种散热装置，其包括在其基部的导管。 开口从基部的耗散表面延伸到导管。 导管允许来自风扇的空气在基部内流动，这可以改善从热点排出的热量，并减轻散热装置中的空气滞留。

公开(公告)号：AT403956T

公开(公告)日：2008-08-15

申请号：AT01979711

申请日：2001-10-12

Applicant: INTEL CORP

Inventor： SEARLS DAMION ,  DISHONGH TERRANCE ,  DUJARI PRATEEK ,  LIAN BIN

IPC: H01R4/02 ,  H01R12/57 ,  H01R12/70 ,  H05K3/34

Abstract: An enhanced joint thickness lead used for surface mounting electronic devices to a substrate, wherein a portion of the enhanced joint thickness lead that is substantially parallel to the substance. The enhanced joint thickness lead includes an arcuate structure, which provides an enhanced joint thickness for the solder used to connect the lead to the substrate. The enhanced joint thickness of the solder results in a more robust attachment of the electronic device.

公开(公告)号：DE60130450D1

公开(公告)日：2007-10-25

申请号：DE60130450

申请日：2001-04-03

Applicant: INTEL CORP

Inventor： DISHONGH TERRANCE ,  SEARLS DAMION ,  LIAN BIN ,  DUJARI PRATEEK

IPC: F16F15/02 ,  H05K1/02 ,  F16F15/00 ,  G05D19/02 ,  H05K1/18

Abstract: Piezoelectric wafers are affixed to a circuit card to control displacement of the circuit card when vibrated. A trigger wafer located at an anti-node of the dominant mode shape produces a voltage as a function of modal displacement. A control system responsive to the trigger wafer produces voltages that are applied to flex wafers at a different anti-node of the dominant mode shape. The flex wafers expand and contract in a manner that reduces the modal displacement of the circuit card. Multiple flex wafers can exist, affixed to the circuit card substantially opposite each other, or a single flex wafer can exist with a single trigger wafer. The trigger wafer can be located substantially opposite the flex wafer or can be located elsewhere on the circuit card.

公开(公告)号：AT373943T

公开(公告)日：2007-10-15

申请号：AT01923364

申请日：2001-04-03

Applicant: INTEL CORP

Inventor： DISHONGH TERRANCE ,  SEARLS DAMION ,  LIAN BIN ,  DUJARI PRATEEK

IPC: G01K1/14 ,  H05K1/02 ,  H05K1/18

Abstract: Piezoelectric material is embedded in epoxy layers of circuit cards to control thermal expansion and contraction as a function of temperature changes. A temperature sensor and thermostat generates a controlled voltage as a function of temperature and applies the voltage to piezoelectric blocks within the circuit card. Local areas of the circuit card can have different amounts of piezoelectric material or different thermostats. Piezoelectric blocks can be arranged in regular patterns or can be randomly or pseudo-randomly placed.

公开(公告)号：AU4793701A

公开(公告)日：2001-11-12

申请号：AU4793701

申请日：2001-04-03

Applicant: INTEL CORP

Inventor： DISHONGH TERRANCE ,  SEARLS DAMION ,  LIAN BIN ,  DUJARI PRATEEK

IPC: F16F15/02 ,  F16F15/00 ,  G05D19/02 ,  H05K1/02 ,  H05K1/18

Abstract: Piezoelectric wafers are affixed to a circuit card to control displacement of the circuit card when vibrated. A trigger wafer located at an anti-node of the dominant mode shape produces a voltage as a function of modal displacement. A control system responsive to the trigger wafer produces voltages that are applied to flex wafers at a different anti-node of the dominant mode shape. The flex wafers expand and contract in a manner that reduces the modal displacement of the circuit card. Multiple flex wafers can exist, affixed to the circuit card substantially opposite each other, or a single flex wafer can exist with a single trigger wafer. The trigger wafer can be located substantially opposite the flex wafer or can be located elsewhere on the circuit card.

公开(公告)号：DE10196822B4

公开(公告)日：2007-08-30

申请号：DE10196822

申请日：2001-10-12

Applicant: INTEL CORP

Inventor： SEARLS DAMION ,  DISHONGH TERRANCE ,  DUJARI PRATEEK ,  LIAN BIN

IPC: H01R4/02 ,  H01R12/57 ,  H01R12/70 ,  H05K3/34

Abstract: An enhanced joint thickness lead used for surface mounting electronic devices to a substrate, wherein a portion of the enhanced joint thickness lead that is substantially parallel to the substance. The enhanced joint thickness lead includes an arcuate structure, which provides an enhanced joint thickness for the solder used to connect the lead to the substrate. The enhanced joint thickness of the solder results in a more robust attachment of the electronic device.

公开(公告)号：MY127104A

公开(公告)日：2006-11-30

申请号：MYPI20011796

申请日：2001-04-14

Applicant: INTEL CORP

Inventor： DISHONGH TERRANCE J ,  SEARLS DAMION T ,  DUJARI PRATEEK ,  LIAN BIN

IPC: G01K1/14 ,  H05K1/02 ,  H01L41/08 ,  H05K1/18

Abstract: PIEZOELECTRIC MATERIAL IS EMBEDDED IN EPOXY LAYERS (220) OF CIRCUIT CARDS (102) TO CONTROL THERMAL EXPANSION AND CONTRACTION AS A FUNCTION OF TEMPERATURE CHANGES. A TEMPERATURE SENSOR (212) AND THERMOSTAT (214) GENERATES A CONTROLLED VOLTAGE AS A FUNCTION OF TEMPERATURE AND APPLIES THE VOLTAGE TO PIEZOELECTRIC BLOCKS (120) WITHIN THE CIRCUIT CARD (102). LOCAL AREAS OF THE CIRCUIT CARD CAN HAVE DIFFERENT AMOUNTS OF PIEZOELECTRIC MATERIAL OR DIFFERENT THERMOSTAT. PIEZOELECTRIC BLOCKS (120) CAN BE ARRANGED IN REGULAR PATTERNS OR CAN BE RANDOMLY OR PSEUDO-RANDOMLY PLACED.(FIG 2)

公开(公告)号：HK1050104A1

公开(公告)日：2003-06-06

申请号：HK03102282

申请日：2003-03-31

Applicant: INTEL CORP

Inventor： DISHONGH TERRANCE ,  SEARLS DAMION ,  LIAN BIN ,  DUJARI PRATEEK

IPC: F16F15/02 ,  F16F20060101 ,  H05K20060101 ,  F16F15/00 ,  G05D19/02 ,  H05K1/02 ,  H05K1/18

Abstract: Piezoelectric wafers are affixed to a circuit card to control displacement of the circuit card when vibrated. A trigger wafer located at an anti-node of the dominant mode shape produces a voltage as a function of modal displacement. A control system responsive to the trigger wafer produces voltages that are applied to flex wafers at a different anti-node of the dominant mode shape. The flex wafers expand and contract in a manner that reduces the modal displacement of the circuit card. Multiple flex wafers can exist, affixed to the circuit card substantially opposite each other, or a single flex wafer can exist with a single trigger wafer. The trigger wafer can be located substantially opposite the flex wafer or can be located elsewhere on the circuit card.

公开(公告)号：DE60135241D1

公开(公告)日：2008-09-18

申请号：DE60135241

申请日：2001-10-12

Applicant: INTEL CORP

Inventor： SEARLS DAMION ,  DISHONGH TERRANCE ,  DUJARI PRATEEK ,  LIAN BIN

IPC: H01R4/02 ,  H01R12/57 ,  H01R12/70 ,  H05K3/34

Abstract: An enhanced joint thickness lead used for surface mounting electronic devices to a substrate, wherein a portion of the enhanced joint thickness lead that is substantially parallel to the substance. The enhanced joint thickness lead includes an arcuate structure, which provides an enhanced joint thickness for the solder used to connect the lead to the substrate. The enhanced joint thickness of the solder results in a more robust attachment of the electronic device.