公开(公告)号：JP2014179985A

公开(公告)日：2014-09-25

申请号：JP2014048166

申请日：2014-03-11

Applicant: Intel Corp ,  インテル コーポレイション

Inventor： TELESPHOR KAMGAING ,  ADEL A ELSHERBINI

IPC: H01Q3/26 ,  H01Q3/24 ,  H01Q15/08 ,  H01Q21/06 ,  H01Q23/00 ,  H04B7/10

CPC classification number: H01Q21/293 ,  H01L2224/16225 ,  H01P11/00 ,  H01Q1/36 ,  H01Q1/50 ,  H01Q3/24 ,  H01Q3/26 ,  H01Q15/08 ,  H01Q21/061 ,  H01Q21/065 ,  H01Q23/00 ,  H01Q25/00 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: PROBLEM TO BE SOLVED: To provide a single package communication device including antenna elements forming a plurality of independently selectable arrays.SOLUTION: An antenna element in a different array can transmit and/or receive a data signal in a different signal angle range. The communication device can include a switch module that separately activates an individual array. A radio frequency (RF) communication module can be included in a communication device package. The RF communication module can be configured to perform communication in a millimeter wave network using the plurality of antenna element arrays.

Abstract translation: 要解决的问题：提供包括形成多个可独立选择的阵列的天线元件的单个包装通信装置。解决方案：不同阵列中的天线元件可以在不同的信号角度范围内发送和/或接收数据信号。 通信设备可以包括分开激活单个阵列的交换机模块。 射频（RF）通信模块可以包括在通信设备包中。 RF通信模块可以被配置为使用多个天线元件阵列在毫米波网络中执行通信。

公开(公告)号：JP2014123945A

公开(公告)日：2014-07-03

申请号：JP2013259964

申请日：2013-12-17

Applicant: Intel Corp ,  インテル コーポレイション

Inventor： TELESPHOR KAMGAING ,  VALLURI RAO ,  OFIR DEGANI

IPC: H01P5/08 ,  H01Q1/38

CPC classification number: H01Q9/045 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01P11/00 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q1/526 ,  H01Q21/0006 ,  Y10T29/49018

Abstract: PROBLEM TO BE SOLVED: To provide methods of forming a microelectronic packaging structure and associated structures formed thereby.SOLUTION: Those methods and structures may include forming a package structure comprising: a discrete antenna disposed on a back side of a device, where the discrete antenna comprises an antenna substrate; and a through antenna substrate via vertically disposed through the antenna substrate. A through device substrate via that is vertically disposed within the device is coupled with the through antenna substrate via, and a package substrate is coupled with an active side of the device.

Abstract translation: 要解决的问题：提供形成微电子封装结构和由此形成的相关结构的方法。解决方案：这些方法和结构可以包括形成封装结构，其包括：设置在器件背面的分立天线，其中离散天线 包括天线基板; 以及通过天线基板垂直设置的通过天线基板。 垂直设置在器件内的穿通器件衬底通孔经由天线衬底与封装衬底耦合，并且封装衬底与器件的有源侧耦合。

公开(公告)号：JP2012065371A

公开(公告)日：2012-03-29

申请号：JP2012000165

申请日：2012-01-04

Applicant: Intel Corp ,  インテル コーポレイション

Inventor： TELESPHOR KAMGAING

IPC: H01Q21/06 ,  H01Q1/52 ,  H01Q13/08

CPC classification number: H01Q1/2258 ,  H01Q1/241 ,  H01Q15/008

Abstract: PROBLEM TO BE SOLVED: To provide, in the field of antennas, a multiband antenna array using electromagnetic bandgap structures.SOLUTION: In an embodiment, a multiband antenna array using electromagnetic bandgap structures is provided. In this regard, an antenna array is introduced having two or more planar antennas disposed substantially on a surface of a substrate, a first set of electromagnetic bandgap (EBG) cells disposed substantially between and on plane with the antennas, and a second set of EBG cells disposed within the substrate and below the antennas. Other embodiments are also disclosed and claimed.

Abstract translation: 要解决的问题：在天线领域中，提供使用电磁带隙结构的多频带天线阵列。 解决方案：在一个实施例中，提供了使用电磁带隙结构的多频带天线阵列。 在这方面，引入天线阵列，其具有基本上设置在基板的表面上的两个或更多个平面天线，基本上与天线平面配置的第一组电磁带隙（EBG）单元，以及第二组EBG 设置在衬底内并在天线之下的电池。 还公开并要求保护其他实施例。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：NL2029302A

公开(公告)日：2022-06-17

申请号：NL2029302

申请日：2021-10-01

Applicant: INTEL CORP

Inventor： TAL SHOSHANA ,  ELI BOROKHOVICH ,  EHUD RESHEF ,  TELESPHOR KAMGAING ,  JAYPRAKASH THAKUR ,  ERAN SEGEV ,  JOSE RODRIGO CAMACHO PEREZ ,  EYTAN MANN ,  SHAHAR GROSS ,  MARUTI TAMRAKAR ,  SEONG-YOUP J SUH ,  AMIR RUBIN ,  TAE-YOUNG YANG ,  TIMO SAKARI HUUSARI ,  RONEN KRONFELD ,  KWAN HO LEE ,  BENJAMIN OFER ,  OFIR DEGANI ,  ASHOKE RAVI ,  JAEJIN LEE ,  DONG-HO HAN ,  HARRY SKINNER

IPC: H01Q23/00

Abstract: In various aspects, a radio frequency circuit is provided. The radio frequency circuit may include a substrate that may include a radio frequency front-end to antenna (RF FE-to-Ant) connector. The RF FE-to-Ant connector may include a conductor track structure and a substrate connection structure coupled to the conductor track structure. The substrate may include radio frequency front-end circuitry monolithically integrated in the substrate. The substrate connection structure may include at least one of a solderable structure, a weldable structure, or an adherable structure. The substrate connection structure may be configured to form at least one radio frequency signal interface with an antenna circuit connection structure of a substrate-external antenna circuit. The substrate may include an edge region. The substrate connection structure may be disposed in the edge region.

公开(公告)号：BR112014016136A2

公开(公告)日：2017-06-13

申请号：BR112014016136

申请日：2013-06-28

Applicant: INTEL CORP

Inventor： OFIR DEGANI ,  TELESPHOR KAMGAING ,  VALLURI R RAO

IPC: H01Q1/24 ,  H01Q1/38

Abstract: resumo patente de invenção: "estruturas de pacote incluindo antenas distintas montadas em um dispositivo". métodos de formar uma estrutura de empacotamento microeletrônica e estruturas associadas formadas assim são descritas. esses métodos e estruturas podem incluir formar uma estrutura de pacote compreendendo uma antena distinta disposta em um lado traseiro de um dispositivo, em que a antena distinta compreende um substrato de antena, uma via através de substrato de antena disposta verticalmente através do substrato de antena. uma via através de substrato de dispositivo que é disposta verticalmente dentro do dispositivo é acoplada à via através de substrato de antena, e um substrato de pacote é acoplado a um lado ativo do dispositivo.

公开(公告)号：NL2029884A

公开(公告)日：2022-07-19

申请号：NL2029884

申请日：2021-11-23

Applicant: INTEL CORP

Inventor： DEBABANI CHOUDHURY ,  STEFANO PELLERANO ,  OMKAR KARHADE ,  ONER ORHAN ,  KENNETH P FOUST ,  TAE-YOUNG YANG ,  SAI VADLAMANI ,  TELESPHOR KAMGAING ,  SHUHEI YAMADA ,  TOLGA ACIKALIN ,  PETER SAGAZIO ,  CHRISTOPHER D HULL ,  ISSY KIPNIS ,  ROYA DOOSTNEJAD ,  HOSEIN NIKOPOUR ,  MEHNAZ RAHMAN

IPC: H01L25/065 ,  H04B7/00

Abstract: Various devices, systems, and/or methods perform wireless chip to chip high speed data transmission. Strategies for such transmission include use of improved microbump antennas, wireless chip to chip interconnects, precoding and decoding strategies, channel design to achieve spatial multiplexing gain in line of sight transmissions, open cavity chip design for improved transmission, and/or mixed signal channel equalization.

公开(公告)号：NL2029704A

公开(公告)日：2022-07-19

申请号：NL2029704

申请日：2021-11-11

Applicant: INTEL CORP

Inventor： TELESPHOR KAMGAING ,  ARNAUD AMADJIKPE ,  ZHEN ZHOU ,  BRYCE D HORINE ,  CHIA-PIN CHIU ,  JASON A MIX ,  KENNETH P FOUST ,  TOLGA ACIKALIN ,  SAI VADLAMANI ,  TIMOTHY F COX ,  RENZHI LIU ,  BRENT R CARLTON ,  TAE-YOUNG YANG

IPC: H04M1/02 ,  H01L23/538 ,  H01Q23/00

Abstract: In various aspects, a device-to-device communication system is provided including a first device and a second device. Each of the first device and the second device includes an antenna, a radio frequency frond-end circuit, and a baseband circuit. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a cover structure housing the first device and the second device. Each of the first device and the second device are at least one of a chiplet or a package. The device-to- device communication system further includes a radio frequency signal interface wirelessly communicatively coupling the first device and the second device. The radio frequency signal interface includes the first antenna and the second antenna.

公开(公告)号：GB2520149B

公开(公告)日：2018-05-16

申请号：GB201416330

申请日：2014-09-16

Applicant: INTEL CORP

Inventor： TELESPHOR KAMGAING ,  VALLURI R RAO

IPC: H01L23/48 ,  H01L23/498 ,  H01L23/538

Abstract: A die package is described that includes a substrate to carry passive components. In one example, the package has a semiconductor die having active circuitry near a front side of the die and having a back side opposite the front side, and a component substrate near the back side of the die. A plurality of passive electrical components are on the component substrate and a conductive path connects a passive component to the active circuitry. The die has a silicon substrate between the front side and the back side and the conductive path is a through-silicon via through the die from the back side to the active circuit.

公开(公告)号：BR112014016136A8

公开(公告)日：2017-07-04

申请号：BR112014016136

申请日：2013-06-28

Applicant: INTEL CORP

Inventor： OFIR DEGANI ,  TELESPHOR KAMGAING ,  VALLURI R RAO

IPC: H01Q1/24 ,  H01Q1/38

Abstract: resumo patente de invenção: "estruturas de pacote incluindo antenas distintas montadas em um dispositivo". métodos de formar uma estrutura de empacotamento microeletrônica e estruturas associadas formadas assim são descritas. esses métodos e estruturas podem incluir formar uma estrutura de pacote compreendendo uma antena distinta disposta em um lado traseiro de um dispositivo, em que a antena distinta compreende um substrato de antena, uma via através de substrato de antena disposta verticalmente através do substrato de antena. uma via através de substrato de dispositivo que é disposta verticalmente dentro do dispositivo é acoplada à via através de substrato de antena, e um substrato de pacote é acoplado a um lado ativo do dispositivo.

公开(公告)号：DE102013114594B4

公开(公告)日：2022-03-17

申请号：DE102013114594

申请日：2013-12-20

Applicant: INTEL CORP

Inventor： TELESPHOR KAMGAING ,  RAO VALLURI ,  DEGANI OFIR

IPC: H01L21/50 ,  H01L21/60 ,  H01L23/02 ,  H01L23/58

Abstract: Verfahren zum Ausbilden einer Paketstruktur (100; 131; 132), das Folgendes umfasst:Bereitstellen eines elektronischen Bauelements (118) mit einer aktiven Seite (120) und einer gegenüberliegenden Rückseite;Bereitstellen eines Paketsubstrats (126) auf der aktiven Seite (120) des Bauelements (118);Bilden einer diskreten Antenne (102) auf der Rückseite des Bauelements (118), wobei die diskrete Antenne (102) ein Antennensubstrat (104) umfasst;Bilden einer Antennensubstrat-Durchkontaktierung (108) durch das Antennensubstrat (104), wobei die Antennensubstrat-Durchkontaktierung (108) vertikal durch das Antennensubstrat (104) angeordnet ist,Koppeln der Antennensubstrat-Durchkontaktierung (108) mit einer Substrat-Durchkontaktierung (116), die vertikal innerhalb des Bauelements (118) angeordnet ist, undelektrisches Koppeln des Bauelements (118) mit dem Paketsubstrat (126),wobei die Antennensubstrat-Durchkontaktierung (108) mit der Substrat-Durchkontaktierung (116) durch eine leitende Struktur oder Metall-Metall-Bindung gekoppelt ist,wobei das Verfahren ferner das Bilden eines Erdantennenkontakts (111) auf einem unteren Abschnitt der diskreten Antenne (102) umfasst,wobei der Erdantennenkontakt (111) mit einer Erdungssubstrat-Durchkontaktierung (117) elektrisch gekoppelt ist, die vertikal innerhalb des Bauelements (118) angeordnet ist.