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公开(公告)号：AU2003297020A1
公开(公告)日：2004-07-29
申请号：AU2003297020
申请日：2003-12-11
Applicant: INTEL CORP
Inventor： WAIZMAN ALEXANDER , PETER ERIK , CHUNG CHEE-YEE
Abstract: An apparatus is disclosed. The apparatus has a printed circuit board and one or several integrated circuit substrates mounted to the printed circuit board. At least one SMT component with two or more terminals is arranged between the printed circuit board and the package. In one embodiment, the SMT component replaces interconnects in the ball grid array used to mount the substrate to the printed circuit board while simultaneously connecting the SMT terminals to the substrate and the printed circuit board. The disclosed apparatus of SMT components mount results in significant reduction of inductance of the SMT connection to the substrate.
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