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公开(公告)号：WO2004032234A3
公开(公告)日：2004-10-14
申请号：PCT/US0329767
申请日：2003-09-19
Applicant: INTEL CORP
Inventor： OSBURN EDWARD , PETER ERIK , GATES TIMOTHY
IPC: H01L23/498 , H01L23/50 , H05K1/02 , H05K1/11 , H05K3/42
CPC classification number: H05K1/0262 , H01L23/49838 , H01L23/50 , H01L2924/0002 , H05K1/0219 , H05K1/0231 , H05K1/0263 , H05K1/112 , H05K3/429 , H05K2201/093 , H05K2201/1003 , H05K2201/10515 , H05K2201/10545 , H05K2201/10704 , H05K2201/10734 , H01L2924/00
Abstract: A method and an apparatus for improving the delivery and filtering of power to a semiconductor device is disclosed by organizing out interconnects (pins, balls, pads or other interconnects) used to carry power in a striped configuration that shortens the conductive path required between a power source and a semiconductor device and that reduces the resistance of that conductive path.
Abstract translation: 本发明公开了一种用于改善向半导体器件的功率的传递和过滤的方法和设备，其通过组织用于以条形配置承载功率的互连（引脚，球，焊盘或其他互连），以缩短功率之间所需的导电路径 源和半导体器件，并且减小该导电路径的电阻。
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公开(公告)号：AU2003272621A1
公开(公告)日：2004-04-23
申请号：AU2003272621
申请日：2003-09-19
Applicant: INTEL CORP
Inventor： OSBURN EDWARD , PETER ERIK , GATES TIMOTHY
IPC: H01L23/498 , H01L23/50 , H05K1/02 , H05K1/11 , H05K3/42
Abstract: A method and an apparatus for improving the delivery and filtering of power to a semiconductor device is disclosed by organizing out interconnects (pins, balls, pads or other interconnects) used to carry power in a striped configuration that shortens the conductive path required between a power source and a semiconductor device and that reduces the resistance of that conductive path.
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公开(公告)号：AU2003297020A1
公开(公告)日：2004-07-29
申请号：AU2003297020
申请日：2003-12-11
Applicant: INTEL CORP
Inventor： WAIZMAN ALEXANDER , PETER ERIK , CHUNG CHEE-YEE
Abstract: An apparatus is disclosed. The apparatus has a printed circuit board and one or several integrated circuit substrates mounted to the printed circuit board. At least one SMT component with two or more terminals is arranged between the printed circuit board and the package. In one embodiment, the SMT component replaces interconnects in the ball grid array used to mount the substrate to the printed circuit board while simultaneously connecting the SMT terminals to the substrate and the printed circuit board. The disclosed apparatus of SMT components mount results in significant reduction of inductance of the SMT connection to the substrate.
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公开(公告)号：AU2003272621A8
公开(公告)日：2004-04-23
申请号：AU2003272621
申请日：2003-09-19
Applicant: INTEL CORP
Inventor： OSBURN EDWARD , PETER ERIK , GATES TIMOTHY
IPC: H01L23/498 , H01L23/50 , H05K1/02 , H05K1/11 , H05K3/42
Abstract: A method and an apparatus for improving the delivery and filtering of power to a semiconductor device is disclosed by organizing out interconnects (pins, balls, pads or other interconnects) used to carry power in a striped configuration that shortens the conductive path required between a power source and a semiconductor device and that reduces the resistance of that conductive path.
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