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公开(公告)号：US11755080B2
公开(公告)日：2023-09-12
申请号：US17560719
申请日：2021-12-23
Applicant: Intel Corporation
Inventor： Prakash Kurma Raju , Babu Triplicane Gopikrishnan , Bijendra Singh , Prasanna Pichumani , Raghavendra Doddi , Harish Jagadish , Gopinath Kandasamy , David Pidwerbecki
CPC classification number: G06F1/203 , G06F1/1616 , G06F1/1637 , G06F1/1647 , G06F1/1681 , H04M1/022 , H05K7/2039 , G06F3/041 , G06F2200/203 , H04M1/0216 , H04M2250/16
Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
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公开(公告)号：US20220113759A1
公开(公告)日：2022-04-14
申请号：US17560719
申请日：2021-12-23
Applicant: Intel Corporation
Inventor： Prakash Kurma Raju , Babu Triplicane Gopikrishnan , Bijendra Singh , Prasanna Pichumani , Raghavendra Doddi , Harish Jagadish , Gopinath Kandasamy , David Pidwerbecki
Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
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公开(公告)号：US20190045658A1
公开(公告)日：2019-02-07
申请号：US15859396
申请日：2017-12-30
Applicant: Intel Corporation
Inventor： David Pidwerbecki , Jerrod Peterson , Christopher Moore
Abstract: Thermal exchanger securing devices, and compute resources that include one or more thermal exchanger securing devices, are disclosed herein. The thermal exchanger securing devices are used to secure a thermal exchanger to an integrated circuit package, and to secure a thermal exchanger and an integrated circuit package of a compute resource to a printed circuit board.
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公开(公告)号：US10027160B2
公开(公告)日：2018-07-17
申请号：US15081341
申请日：2016-03-25
Applicant: INTEL CORPORATION
Inventor： Ralph V. Miele , David G. Payne , Brandon Courtney , Isaac A. Simpson , Andrew Larson , David Pidwerbecki , Patrick Chewning
Abstract: A method is provided for forming a wireless charging electronic device. An embodiment of the method includes integrating a coil and a collector plate to a chassis of the electronic device to wirelessly charge the electronic device.
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公开(公告)号：US09715255B2
公开(公告)日：2017-07-25
申请号：US14318257
申请日：2014-06-27
Applicant: Intel Corporation
Inventor： Mark E. Sprenger , Russell S. Aoki , Shawn McEuen , Mark MacDonald , David Pidwerbecki
IPC: G06F1/16
CPC classification number: G06F1/1681 , G06F1/1616 , H04M1/022
Abstract: In one example an electronic device comprises a controller, a chassis comprising a first section and a second section, and a hinge assembly to connect the first section of the chassis to the second section of the chassis comprising a housing, a first shaft rotatable about a first axis, a second shaft rotatable about a second axis, a belt drive assembly to couple the first shaft to the second shaft, and a tension assembly to apply a tension to the belt drive assembly. Other examples may be described.
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Patent Agency Ranking
公开(公告)号：US20240210988A1
公开(公告)日：2024-06-27
申请号：US18129524
申请日：2023-03-31
Applicant: Intel Corporation
Inventor： David Pidwerbecki , Arvind S , Jeff Ku , Juha Tapani Paavola , Prakash Kurma Raju , Amruta Krishnakumar Ranade , Sudheera Sudhakar , Mousumi Deka , Snehal Chaudhari , Akarsha R. Kadadevaramath
CPC classification number: G06F1/1615 , B32B5/02 , B32B5/26 , C23C14/205 , C23C14/35 , C23C16/06 , B32B2255/02 , B32B2255/205 , B32B2255/28 , B32B2260/023 , B32B2260/046 , B32B2457/00
Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed related to composite materials for electronic device chassis. An example electronic device includes a chassis including a layer of a magnesium alloy or a layer of polyether ether ketone and carbon fiber reinforced plastic and an anodized aluminum coating.
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7.发明授权公开(公告)号：US11807243B2
公开(公告)日：2023-11-07
申请号：US17570244
申请日：2022-01-06
Applicant: Intel Corporation
Inventor： Yoshifumi Nishi , David Pidwerbecki , David Browning , Mark Angus MacDonald
IPC: B60W40/06 , G08G1/01 , G05D1/00 , G08G1/09 , G07C5/00 , B60W40/068 , G08G1/0967 , G07C5/08
CPC classification number: B60W40/068 , G05D1/0088 , G07C5/008 , G07C5/0808 , G08G1/0112 , G08G1/096725 , G08G1/096775 , B60W2552/40 , B60W2556/45 , B60W2556/50 , B60W2756/10 , G05D2201/0213
Abstract: Embodiments include apparatuses, methods, and systems for computer assisted or autonomous driving (CA/AD). An apparatus for CA/AD may include a sensor interface, a communication interface, and a driving strategy unit. The sensor interface may receive sensor data indicative of friction between a road surface of a current location of a CA/AD vehicle and one or more surfaces of one or more tires of the CA/AD vehicle. The communication interface may receive, from an external road surface condition data source, data indicative of friction for a surface of a road section ahead of the current location of the CA/AD vehicle. The driving strategy unit may determine, based at least in part on the sensor data and the data received from the external road surface condition data source, a driving strategy for the CA/AD vehicle beyond the current location of the CA/AD vehicle. Other embodiments may also be described and claimed.
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公开(公告)号：US11545410B2
公开(公告)日：2023-01-03
申请号：US16222854
申请日：2018-12-17
Applicant: Intel Corporation
Inventor： Mark MacDonald , David Pidwerbecki , Mark Gallina , Jerrod Peterson
IPC: H01L23/34 , H01L23/367 , H01L23/373 , H01L23/42 , H01L23/40 , H01L23/24 , H01L23/473
Abstract: Enhanced thermal energy transfer systems for semiconductor packages are provided. A thermally conductive member is disposed in the interstitial space between an upper surface of a semiconductor package and a lower surface of a thermal member. The thermally conductive member is disposed above a first portion of the upper surface of the semiconductor package having a relatively higher thermal energy output when the semiconductor package is operating. A thermal interface material is disposed in the interstitial space and a force applied to the thermal member. The thermally conductive member forms a relatively higher pressure region above the first portion of the semiconductor package and a relatively lower pressure region in other portions of the semiconductor package remote from the thermally conductive member. The increased pressure region proximate the thermally conductive member beneficially enhances the flow of thermal energy from the first portion of the semiconductor package to the thermal member.
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9.发明授权公开(公告)号：US11267475B2
公开(公告)日：2022-03-08
申请号：US16802140
申请日：2020-02-26
Applicant: Intel Corporation
Inventor： Yoshifumi Nishi , David Pidwerbecki , David Browning , Mark Angus MacDonald
IPC: B60W40/06 , G08G1/01 , G05D1/00 , G08G1/09 , G07C5/08 , B60W40/068 , G08G1/0967 , G07C5/00
Abstract: Embodiments include apparatuses, methods, and systems for computer assisted or autonomous driving (CA/AD). An apparatus for CA/AD may include a sensor interface, a communication interface, and a driving strategy unit. The sensor interface may receive sensor data indicative of friction between a road surface of a current location of a CA/AD vehicle and one or more surfaces of one or more tires of the CA/AD vehicle. The communication interface may receive, from an external road surface condition data source, data indicative of friction for a surface of a road section ahead of the current location of the CA/AD vehicle. The driving strategy unit may determine, based at least in part on the sensor data and the data received from the external road surface condition data source, a driving strategy for the CA/AD vehicle beyond the current location of the CA/AD vehicle. Other embodiments may also be described and claimed.
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公开(公告)号：US20190139855A1
公开(公告)日：2019-05-09
申请号：US16222854
申请日：2018-12-17
Applicant: Intel Corporation
Inventor： Mark MacDonald , David Pidwerbecki , Mark Gallina , Jerrod Peterson
IPC: H01L23/367 , H01L23/373
Abstract: Enhanced thermal energy transfer systems for semiconductor packages are provided. A thermally conductive member is disposed in the interstitial space between an upper surface of a semiconductor package and a lower surface of a thermal member. The thermally conductive member is disposed above a first portion of the upper surface of the semiconductor package having a relatively higher thermal energy output when the semiconductor package is operating. A thermal interface material is disposed in the interstitial space and a force applied to the thermal member. The thermally conductive member forms a relatively higher pressure region above the first portion of the semiconductor package and a relatively lower pressure region in other portions of the semiconductor package remote from the thermally conductive member. The increased pressure region proximate the thermally conductive member beneficially enhances the flow of thermal energy from the first portion of the semiconductor package to the thermal member.
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