SUBSTRATE INTEGRATED WAVEGUIDE
    1.
    发明申请
    SUBSTRATE INTEGRATED WAVEGUIDE 审中-公开
    基片集成波导

    公开(公告)号:WO2017105388A1

    公开(公告)日:2017-06-22

    申请号:PCT/US2015/065511

    申请日:2015-12-14

    CPC classification number: G02B6/122 G02B6/132 G02B6/134

    Abstract: This document discusses, among other things, a waveguide including a first metal having an outer surface proximate a dielectric material and an inner surface defining a path of the waveguide, a method of receiving an optical signal at the inner surface of the waveguide and transmitting the optical signal along at least a portion of the path of the waveguide. A method of integrating a waveguide in a substrate includes depositing sacrificial metal on a first surface of a carrier substrate to form a core of the waveguide, depositing a first metal over the sacrificial metal and at least a portion of the first surface of the carrier substrate, forming an outer surface of the waveguide and a conductor separate from the sacrificial metal, and depositing dielectric material over the first surface of the carrier substrate about the conductor.

    Abstract translation: 该文献尤其讨论了一种波导,该波导包括第一金属和第二金属,该第一金属具有接近介电材料的外表面和限定波导的路径的内表面,在该接收器处接收光信号的方法 所述波导的内表面并且沿着所述波导的所述路径的至少一部分传输所述光信号。 一种将波导集成在衬底中的方法包括在载体衬底的第一表面上沉积牺牲金属以形成波导的核心,在牺牲金属上沉积第一金属以及载体衬底的第一表面的至少一部分 ,形成波导的外表面和与牺牲金属分开的导体,并且在载体衬底的第一表面上围绕导体沉积介电材料。

Patent Agency Ranking