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    SEMICONDUCTOR FIN DESIGN TO MITIGATE FIN COLLAPSE
    3.
    发明申请
    SEMICONDUCTOR FIN DESIGN TO MITIGATE FIN COLLAPSE 审中-公开

    公开(公告)号：WO2018125179A1

    公开(公告)日：2018-07-05

    申请号：PCT/US2016/069368

    申请日：2016-12-30

    Applicant: INTEL CORPORATION

    Inventor： GLASS, Glenn A. ,  PAWASHE, Chytra ,  MURTHY, Anand S. ,  PANTUSO, Daniel ,  GHANI, Tahir

    IPC: H01L29/78 ,  H01L29/66

    Abstract: Fin-based transistor structures, such as finFET and nanowire transistor structures, are disclosed. The fins have a morphology including a wave pattern and/or one or more ridges and/or nodules which effectively mitigate fin collapse, by limiting the inter-fin contact during a fin collapse condition. Thus, while the fins may temporarily collapse during wet processing, the morphology allows the collapsed fins to recover back to their uncollapsed state upon drying. The fin morphology may be, for example, an undulating pattern having peaks and troughs (e., sine, triangle, or ramp waves). In such cases, the undulating patterns of neighboring fins are out of phase, such that inter-fin contact during fin collapse is limited to peak/trough contact. In other embodiments, one or more ridges or nodules (short ridges), depending on the length of the fin, effectively limit the amount of inter-fin contact during fin collapse, such that only the ridges/nodules contact the neighboring fin.

    SYNTHETIC JET DELIVERING CONTROLLED FLOW TO SENSOR SYSTEM
    6.
    发明申请
    SYNTHETIC JET DELIVERING CONTROLLED FLOW TO SENSOR SYSTEM 审中-公开
    合成喷嘴将控制流量传输到传感器系统

    公开(公告)号：WO2016094007A1

    公开(公告)日：2016-06-16

    申请号：PCT/US2015/059894

    申请日：2015-11-10

    Applicant: INTEL CORPORATION

    Inventor： GULLBRAND, Jessica ,  COWAN, Melissa A. ,  PAWASHE, Chytra ,  EID, Feras

    IPC: G01N33/00 ,  G01N21/17 ,  G01H13/00 ,  B05B17/00

    CPC classification number: G08B21/182 ,  F15D1/0095 ,  G01N1/2273 ,  G01N1/24 ,  G01N2001/242 ,  G08B21/12 ,  G08B25/08 ,  H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Techniques are disclosed for using synthetic jet technology as an air delivery device for sensing applications. In particular, a synthetic jet device is used to deliver a controlled airflow or other fluidic flow to a sensor measurement area. Such a sensing system can be used to detect accurate concentration of target features present in the ambient surroundings, such as gases, particles, solutions, mixtures, and any other environmental features that can be sensed from a controlled airflow. An example application is air quality monitoring by using one or more synthetic jet devices to deliver a known or otherwise controlled airflow to a sensing area, thereby allowing for detection of harmful or otherwise unacceptable concentrations of particulate matter, gases, or air pollutants. In some embodiments, a synthetic jet device is operatively coupled with a sensor via a flow channel in a common housing, so as to provide a controlled flow sensing system.

    Abstract translation: 公开了使用合成射流技术作为感测应用的空气输送装置的技术。 特别地，合成喷射装置用于将可控气流或其它流体流传送到传感器测量区域。 这种感测系统可用于检测周围环境中存在的目标特征的精确浓度，例如气体，颗粒，溶液，混合物以及可从可控气流中感测到的任何其它环境特征。 示例性应用是通过使用一个或多个合成喷射装置将已知或以其它方式控制的气流传送到感测区域进行空气质量监测，从而允许检测有害或其他不可接受的颗粒物质，气体或空气污染物的浓度。 在一些实施例中，合成喷射装置通过公共壳体中的流动通道与传感器可操作地耦合，以便提供受控的流量感测系统。

    MICRO PICK AND BOND ASSEMBLY
    8.
    发明公开
    MICRO PICK AND BOND ASSEMBLY 审中-公开

    公开(公告)号：EP3207563A1

    公开(公告)日：2017-08-23

    申请号：EP14903978.6

    申请日：2014-10-17

    Applicant: Intel Corporation

    Inventor： CHANG, Peter, L. ,  PAWASHE, Chytra ,  MAYBERRY, Michael, C. ,  TSENG, Jia-Hung

    IPC: H01L21/58

    CPC classification number: H01L21/67144 ,  H01L21/6833 ,  H01L24/75 ,  H01L24/95 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/36 ,  H01L33/44 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0066

    Abstract: Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and-bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.

    Abstract translation: 微型拾取和粘合头，组装方法和设备组装。 在实施例中，微型拾取和粘合头将诸如（微）LED的微型器件元件从源基板一起转移到诸如LED显示器基板的目标基板。 源基板上的锚定和释放结构使得器件元件能够与源基板分离，而压敏粘合剂（PSA）使器件元件能够临时固定到微型拾取和接合头的基座上。 一旦器件元件永久固定到目标衬底上，PSA界面可能通过界面层的剥离和/或热分解而失效。

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