公开(公告)号：WO2003083883A3

公开(公告)日：2003-10-09

申请号：PCT/US2003/003798

申请日：2003-02-07

Applicant: INTEL CORPORATION

Inventor： MA, Qing ,  BERRY, Michele ,  WONG, Daniel ,  RAO, Valluri ,  HECK, John

IPC: B81B7/00

Abstract: A MEMS device (14) may be formed in a hermetic cavity (42) by sealing a pair of semiconductor structures (22, 32) to one another, enclosing the MEMS device (12). The two structures (22, 32) may be coupled using surface mount techniques as one example, so that the temperatures utilized may be compatible with many MEMS applications. Electrical interconnection layers (40) in one or the other of these structures may be utilized to allow electrical interconnections from the exterior world to the MEMS components (14) within the cavity (42).

公开(公告)号：WO2003083883A2

公开(公告)日：2003-10-09

申请号：PCT/US2003/003798

申请日：2003-02-07

Applicant: INTEL CORPORATION

Inventor： MA, Qing ,  BERRY, Michele ,  WONG, Daniel ,  RAO, Valluri ,  HECK, John

IPC: H01G

CPC classification number: B81B7/0006 ,  H01L23/10 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A MEMS device (14) may be formed in a hermetic cavity (42) by sealing a pair of semiconductor structures (22, 32) to one another, enclosing the MEMS device (12). The two structures (22, 32) may be coupled using surface mount techniques as one example, so that the temperatures utilized may be compatible with many MEMS applications. Electrical interconnection layers (40) in one or the other of these structures may be utilized to allow electrical interconnections from the exterior world to the MEMS components (14) within the cavity (42).

Abstract translation: 通过将一对半导体结构（22,32）彼此密封，封装MEMS器件（12），可以在密封腔（42）中形成MEMS器件（14）。 作为一个示例，两个结构（22,32）可以使用表面安装技术耦合，使得所利用的温度可以与许多MEMS应用兼容。 这些结构中的一个或另一个中的电互连层（40）可用于允许从外部世界到腔体（42）内的MEMS部件（14）的电互连。

公开(公告)号：WO2003082732A3

公开(公告)日：2003-10-09

申请号：PCT/US2003/003692

申请日：2003-02-05

Applicant: INTEL CORPORATION

Inventor： HECK, John ,  BERRY, Michele ,  WONG, Daniel ,  RAO, Valluri

IPC: B81B7/00

Abstract: A packaged microelectromechanical system (18) may be formed in a hermetic cavity (22) by forming the system (18) on a semiconductor structure (12) and covering the system with a thermally decomposing film (25). That film (25) may then be covered by a sealing cover (20). Subsequently, the thermally decomposing material (25) may be decomposed, forming a cavity (22), which can then be sealed to hermetically enclose the system (18).

公开(公告)号：WO2003082732A2

公开(公告)日：2003-10-09

申请号：PCT/US2003/003692

申请日：2003-02-05

Applicant: INTEL CORPORATION

Inventor： HECK, John ,  BERRY, Michele ,  WONG, Daniel ,  RAO, Valluri

IPC: B81B7/00

CPC classification number: B81C1/00293 ,  B81C1/00936 ,  B81C2201/0108 ,  H01L23/315 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A packaged microelectromechanical system (18) may be formed in a hermetic cavity (22) by forming the system (18) on a semiconductor structure (12) and covering the system with a thermally decomposing film (25). That film (25) may then be covered by a sealing cover (20). Subsequently, the thermally decomposing material (25) may be decomposed, forming a cavity (22), which can then be sealed to hermetically enclose the system (18).

Abstract translation: 封装的微机电系统（18）可以通过在半导体结构（12）上形成系统（18）并用热分解膜（25）覆盖系统而形成在密封腔（22）中。 该薄膜（25）然后可被密封盖（20）覆盖。 随后，热分解材料（25）可能被分解，形成空腔（22），然后将其密封以气密地封闭系统（18）。